Reliability Test Reliability Test Result ReportResult Report
      
 
                                           
LSI Type BA12003BF-E2
Package Type SOP16
PASSPASS
 Reliability Test Result 
  ITEM       TEST METHOD                 DURATION   n   Pn  
*2
Resistance to After the moisture soaking treatment,carry
soldering heat out the soldering heat stress(IR reflow :peak260℃)
                        JEITA ED4701-301 10sec   22   0
*1 Pressure Cooker  
Storage at 121℃/100% (2.026x10
5
Pa)
    -   96hour   22   0
*1 Temperature Cycling Tstg min (30min) / Tstg max (30min) JEITA ED4701-105 100cycles   22   0
High Temperature Storage Storage at Tstg max       JEITA ED4701-201 1000hours   22   0
Low Temperature Storage Storage at Tstg min       JEITA ED4701-202 1000hours   22   0
*1 Temperature Humidity Place at 85℃/85%                  
 Storage                     JEITA ED4701-103 1000hours   22   0
*1 Temperature Humidity Apply the specified voltage at              
 Bias       85℃/85%         JEITA ED4701-102 1000hours   22   0
High Temperature   Apply the specified voltage at              
  Operation Life     Topr max           JEITA ED4701-101 1000hours   22   0  
(pcs) (pcs)
 Strength Test Result 
  ITEM       TEST METHOD                 DURATION   n   Pn  
Terminal strength   Pull force = 2.5N      
JEITA ED4701-401
10sec   5   0
Solderability Dipping temperature 215℃, (Pb)   JEITA ED4701-303 10sec   22   0
          Dipping temperature 245℃, (Pb free) JEITA ED4701-303 5sec   22   0
Electro Static Discharge C=100pF, R=1.5kΩ, 3times, ±2000V
HBM (Human Body Model)     JEITA ED4701-304 -   5   0
C=200pF, R=0Ω, 3times, ±200V                    
MM (Machine Model)       - -   5   0
±750V
          CDM (Charged Device Model)   JESD22-C101 -   5   0
Latch Up Pulse current injection, trigger pulse current ±100mA
                          JEITA ED4701-306 -   5   0  
(pcs) (pcs)
<*1> Soldering Heat examination is executed 3 times for the precondition.
<*2> Moisture soaking treatment Standard : 85℃ 85% 168h / Dry packing : 30℃ 70% 192h
 
    Yoshitaka Ichise
  General Manager
  Quality Control Division
  LSI Production Headquarters
  ROHM Co., Ltd.
www.rohm.com                  
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            SMD2.5-N
©2015 ROHM Co., Ltd. All rights reserved Form:2016.03.01 - Rev.001
R1102
A
www.rohm.com
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Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
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Examples of application circuits, circuit constants and any other information contained herein are
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The Products specified in this document are not designed to be radiation tolerant.
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