Product Information
curamik®
CERAMIC
SUBSTRATES
curamik® Power curamik® Power Plus
curamik® Performance
Al
2
O
3
ceramic based substrates are
standard products with the best price
performance ratio. They are mainly used
in applications of medium and lower
power ranges, such as
// General Power Electronics
// Concentrated Photovoltaics (CPV)
// Peltier Elements
HPS substrates are enhanced in robust-
ness through Zr doped Al
2
O
3
ceramic.
They are mainly used in applications of
medium power ranges, such as
// Advanced Industrial Applications
// Automotive Power Electronics
Substrates based on Si
3
N
4
ceramics are
produced in an AMB process. They are
mainly used in applications where a long
lifetime, high reliability, and robustness
are required and partial discharge should
not occur, such as
// Automotive Power Electronics
// High Reliability Power Modules
// Renewable Energy
curamik® Thermal
Substrates based on AlN ceramics are
used in applications with very high
operational voltages and highest power
density, such as
// Traction
// Smart Grid
// Industrial High Power Modules
// Energy
curamik® CERAMIC SUBSTRATES Product Information
very low low medium high very high
very low
medium
high
very high
Thermal conductivity
Ampacity
low
CU Thin film
CU Thick film
PCB IMS
curamik® Thermal
curamik® Performance (AMB)
curamik® Power
curamik® Power Plus
Performance overview
The information contained in this document is intended to assist you in designing with Rogers’ Power Electronics Solutions Materials. It is not intended to and
does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown in this
document will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers curamik products for each application. The Rogers
logo, the curamik logo and curamik are trademarks of Rogers Corporation or one of its subsidiaries.
© Rogers Corporation. All rights reserved. Publication # . Version ���. en.
curamik® high temperature/high voltage substrates
consist of pure copper bonded to a ceramic substrate such
as Al
2
O
3
(Alumina), AlN (Aluminum Nitride), HPS (ZrO
2
doped) or silicon based Si
3
N
4
(Silicon Nitride).
curamik provides two technologies to attach the substrate
with the copper. DBC (direct bond copper) – a high tem-
perature melting and diffusion process where the pure
copper is bonded onto the ceramic and AMB (active metal
brazing) – a high temperature process where the pure cop-
per is brazed onto the ceramic substrate.
The high heat conductivity of Al
2
O
3
( W/mK), AlN ( W/
mK) and Si
3
N
4
( W/mK) as well as the high heat capacity
and thermal spreading of the thick copper cladding (
m) makes our substrates indispensable to power
electronics. The mechanical stress on silicon chips mounted
directly on the substrate (Chip on Board) is very low, since
the coefficient of thermal expansion (CTE) of the ceramic
substrate is better matched to the CTE of silicon compa-
red to substrates using a metal or a plastic basis. curamik
produces high temperature/high voltage substrates in a
master card format that measures “ x “ and .“ x .“.
The individual parts can be left in the master card format
to support more efficient assembly and mounting of com-
ponents before being separated into individual pieces. We
also offer single pieces for single piece assembly.
Advantages:
// Great heat conductivity and temperature resistance
for high performance and high temperature applications
// High insulation voltage
// High heat spreading
// Adjusted coefficient of thermal expansion
between chip and substrate
// Efficient processing of master cards and single pieces
Rogers Corporation
www.rogerscorp.com/pes
www.curamik.com