EPIC
www.vishay.com
Vishay Sfernice
Revision: 17-Nov-17
1
Document Number: 53041
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Electro-Pyrotechnic Initiator Thin Film Chip Resistor
DESIGN SUPPORT TOOLS
The electro-pyrotechnic initiator thin film chips (EPIC) are
resistors dedicated to pyrotechnic applications. The EPIC
resistors are based on Ta
2
N thin film technology deposited
on specifically prepared ceramic substrate for optimized
dissipation purpose. The standard case geometry (SMD)
enables the implementation of assembly process commonly
used in the electronic component industry (pick and place,
reflow soldering on flat PCB used as header) providing high
productivity. The principle of EPIC is to convert electrical
energy into heat energy in a precise electro-thermal profile
for the purpose of initiating a series of pyrotechnic events in
a controlled energetic reaction. In the mining industry, as the
bridge wire (BW) technology, the EPIC is commonly used in
electronic detonators (digital blasting) for very precise rock
fragmentation. The EPIC resistors are designed for any
pyrotechnic application requiring very fast and reproducible
ignition.
FEATURES
• Surface Mount Design for standard assembly
process
•SMD version only
• Active area designed upon performances
• Case size 0603
• Firing energy down to 50 μJ
• Firing time down to 50 μs
• Ohmic value: 2 to 10 ± 15 % (typical)
(1)
• Joule effect, or flash ignition for very fast firing
• Easy set up by design of firing levels
• “No Fire” / “All Fire” ratio up to 70 %
• Very predictable, reproducible and reliable behavior
• Compatibility with pyrotechnic element has to be tested in
real environment
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Notes
* This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
(1)
For ohmic value < 3
the tolerance will be discussed with Vishay
Sfernice
TECHNOLOGY
The EPIC active area (heating zone) will be impregnated by the user with a primary pyrotechnic material (usually wet primer
followed by drying) in such way to ensure an intimate contact for an optimum heat transfer of thermal energy. The geometry of
the active area of the EPIC, and both the primer chemistry and its impregnation method, will determine the global performances.
Note that the active area of EPIC shall not be put in direct contact with explosive powder as grain size will not ensure intimate
contact and will induce non reproducible and non reliable performances.
The two main characteristics of a EPIC resistor are their “All Fire” (AF) and “No Fire” (NF) performances:
- “All Fire” (AF) represents the command pulse where the major amount of the dissipated energy will be transferred to the primer
to generate the ignition. Customer will have to provide Vishay Sfernice with “All Fire” conditions, usually with capacitance
discharge parameters or with minimum current or voltage and corresponding short pulse duration.
- “No Fire” (NF) represents the immunity of the resistor with primer to the environmental electro-magnetic pollution and electric
continuity test, where the major amount of the dissipated energy will be transferred to the substrate to ensure no ignition.
Customer will have to provide Vishay Sfernice with “No Fire” conditions, usually maximum current or voltage and
corresponding longest duration. In case of applicable capacitance discharge test the parameters shall also be provided.
ASSEMBLY PRECAUTIONS
In order to obtain reproducible ignition performances it is important that the assembly process fulfills the following criteria:
- Do not use iron soldering method to mount the EPIC on its header because uncontrolled amount of solder could impact the
heat transfer (potential misfire or ignition delay).
- Take specific precautions, such as no air bubble during preparation and application of primer, in order to ensure the intimate
contact of pyrotechnic primer and EPIC active area (potential misfire).
- Take specific handling precaution in order not to damage EPIC active area (ex: pickup head design for pick and place or
specific fixing tools in the entire assembly process).
- The EPIC reliability is only guaranteed for one single reflow profile.
- In case of necessity to dismantle an EPIC, another EPIC must be used (no rework is allowed)
- Pay specific attention to the cleaning process after reflow soldering in order not to damage the active area and to keep it clean
from various pollutions
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Available
Models
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EPIC
www.vishay.com
Vishay Sfernice
Revision: 17-Nov-17
2
Document Number: 53041
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1)
Detailed dimensions are specified in Dimensions and Tolerances table
Note
• Ignition performances are dependent on both pyrotechnic primer chemistry and active area geometry
CONSTRUCTION
• Substrate: ceramic (alumina)
• Resistive element: Ta
2
N
• Terminations: SMD wraparound
• Electro-plated gold or hot dipped tin-silver on nickel
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE / CASE
DESIGNATION
(1)
RESISTANCE RANGE
RESISTANCE TOLERANCE
%
EPIC (SMD) 0603 2 to 10 15 to 30
RANGE OF IGNITION PERFORMANCES
MODEL
“NO FIRE”
CURRENT
A
“NO FIRE”
DURATION
s
“ALL FIRE”
CURRENT
A
IGNITION
TIME
ms
“ALL FIRE”
ENERGY
μJ
EPIC 0.3 to 0.8 2 to 5 Down to 0.8 Down to 0.05 Down to 50
DIMENSIONS AND TOLERANCES in millimeters (inches)
MODEL
SIZE / CASE
DESIGNATION
WIDTH
W
LENGTH
L
THICKNESS
T
INSULATION
DISTANCE
I
BACK SIDE
PADS
P
ACTIVE AREA
WIDTH
TOLERANCE
A
EPIC (SMD) 0603
1.52 ± 0.15
(0.080 ± 0.006)
0.76 ± 0.13
(0.030 ± 0.005)
0.40 ± 0.13
(0.016 ± 0.005)
-
0.38 ± 0.13
(0.015 ± 0.005)
± 0.007
(± 0.0003)
Ta
2
N active area
Substrate
Gold or Tin-Silver
Nickel
Substrate
Ta
2
N
Nickel
Gold or Tin-Silver