© Samtec, Inc. February, 2012
MANUFACTURING
Complete Turn-Key Production Services
Medical, Military, Security, Commercial
Prototypes to Volume Production
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ASSEMBLY TECHNOLOGIES
World-Class Wirebond &
Flip Chip Assembly
Stud Bump / Thermocompression
Flip Chip BGA, Flex, Multi-Chip Modules,
COB, Etc. Advanced ICs, MEMS, RF,
Fluidics, Photonics
ULTRA-THIN ELECTRONICS
Wafer / Die Thinning to < 50µm
Die Attach Films, Ultra-Low-Loop
Wirebonding Flow-Over-Wire Adhesives
ENGINEERING SERVICES
Package & Substrate Design
Materials Evaluation & Selection
Assembly Process Development
Reliability Testing, F/A,
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For additional information contact:
Samtec Microelectronics
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aspentechnologies.com
microelectronics@samtec.com
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For more information on microelectronic packaging, contact Samtec’s Microelectronics at: microelectronics@samtec.com
MANUFACTURING
Complete turn-key production services
Design, development, & production
Wirebond & Flip Chip technologies
Organic, ceramic & metal packages
BGA, PGA, COB, DIP, QFP, QFN, CLCC, LGA
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MEMS: Photonics, RF, displays
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Low & Medium volume production
ITAR compliant processes
Supplier Management
FLIP CHIP
Complete turn-key Flip Chip production
Organic & Ceramic substrates
Pb-Free (RoHS)
Eutectic & High Pb
Wafer solder bumping
Au Stud bumping (wafer or die)
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Thermocompression bonding (w/ Au studs)
WIREBONDING
World-class ball bonding & wedge bonding
Finest pitch available (<35 microns)
Ultra-high wire counts
Stacked die & multiple tiers
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Au, Al, & Pt wire alloys
WAFER DICING, DIE SORT & INSPECTION
Up to 300 mm wafers
Any material: Si, GaAs, glass, quartz ceramic,
organics, sapphire, metals
Thin Microelectronics
Thin wafers
Stacked die
Die &wafer tracing
MIL STD & Custom inspections
SEALING AND ENCAPSULATION
RoHS compliant
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Solder Sealing (complex hierarchies)
Parallel seam-sealing
Glass frit and epoxy sealing
Fine & gross leak testing
Custom marking; serialization
CUSTOM ASSEMBLY & ENGINEERING
SERVICES
Package design & Engineering
Material evaluation & selection
Assembly process design
Feasibility studies
Packaging R&D
Reliability, testing, & F/A
Getter integration
Custom functional and electrical testing