PROCESSING RECOMMENDATIONS

For Samtec’s SEAM8/SEAF8 Vertical Connectors

Samtec, Inc., August 2015 Rev. C

The method used to solder these high density connectors is the same as that used for many BGA devices even

though there are some distinct structural differences. BGA’s have spherical solder balls attached to the leads

while the SEAX8 components employ the unique solder charge design.

Fig. 1. Solder Balls on BGA v. Solder Charges on SEAX8

Another difference is that unlike the uniform grid arrangement of BGA’s, the leads of the SEAX8 are in pairs

with alternating pitches of 1.20mm and 0.80mm.

PROCESSING RECOMMENDATIONS

For Samtec’s SEAM8/SEAF8 Vertical Connectors

Samtec, Inc., August 2015 Rev. C

 •Followourrecommendedfootprintsandstencildesigns,foundhere:

•http://www.samtec.com/documents/webles/cpdf/SEAM8-XX-SXX.X-X-XX-X-X-TR-FOOTPRINT.pdf

•http://www.samtec.com/documents/webles/cpdf/SEAF8-XX-05.0-X-XX-X-X-TR-FOOTPRINT.pdf

2. Solder Screen Printing Process

 •Completesolderpadcoverageiscritical.Therecommendedaperturesizeisintentionallylargerthanthe

padtoensurethatthesolderchargecomesintocontactwiththesolderpaste(seeFig.3).Ifthisdoesnot

occur, proper wetting will not be achieved. Automated inspection of each print is recommended. If solder

pastedoesnotcompletelycoverthesolderpadtheassemblyshouldberejected,cleanedandre-printed.

 •Stencilcleaningmayneedtobemonitoredmorefrequentlytoensurecompletesolderpadcoverageis