PROCESSING RECOMMENDATIONS
For Samtec’s SEARAY
TM
(SEAM-RA/SEAF-RA Series) Right Angle Connectors
Samtec, Inc., February 2013 Rev. A
The method used to solder these high density connectors is the same as that used for many BGA devices even
though there are some distinct structural differences. BGA’s have spherical solder balls attached to the leads
while the SEARAY™ Right Angle components employ the unique solder charge design.
Fig. 1. Solder Balls on BGA’s v. Solder Charges on SEARAY™ Right Angle
Additionally, unlike the centralized grid arrangement of BGAs, the solder charges are offset, possibly giving the
illusion that the leads are misaligned with the PCB pads. Note that as shown in image #2 below, the tails are
nominally aligned with the pads while the solder charges are not.
Fig. 2. SEAX-RA Tail Aligned with SMT Pad
These differences are minor, however, and customers will have success by following the simple guidelines
detailed in this document.
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PROCESSING RECOMMENDATIONS
For Samtec’s SEARAY
TM
(SEAM-RA/SEAF-RA Series) Right Angle Connectors
Samtec, Inc., February 2013 Rev. A
1. Basic Recommendations
•Stencilthicknesstobe.006”(0.15mm),
•Followourrecommendedfootprintsandstencildesigns,foundhere:
•http://www.samtec.com/documents/webles/cpdf/SEAM-XX-XX-X-XX-X-RA-XX-FOOTPRINT-MKT.pdf
•http://www.samtec.com/documents/webles/cpdf/SEAF-XX-XX-X-XX-X-RA-XX-XX-FOOTPRINT-MKT.pdf
2. Solder Screen Printing Process
•Completesolderpadcoverageiscritical.Therecommendedaperturesizeisintentionallylargerthanthe
padtoensurethatthesolderchargecomesintocontactwiththesolderpaste(seeFig.3).Ifthisdoesnot
occur, proper wetting will not be achieved. Automated inspection of each print is recommended. If solder
paste does not completely cover the solder pad the assembly should be rejected, cleaned and re-printed.
•Stencilcleaningmayneedtobemonitoredmorefrequentlytoensurecompletesolderpadcoverageis
maintained.
Fig. 3. Solder charge location relative to solder print. Notice good contact between solder charge and paste.
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