Reworking SEARAY
TM
SEAF8-RA Connectors
©Samtec, Inc. Phone: 1-800-SAMTEC-9 Rev.: A
www.samtec.com 812-944-6733 Date: April 14, 2017
Page: 1 Email: info@samtec.com Created by: Lance Cooper
Reworking SEARAY
TM
SEAF8-RA Connectors
This document describes the recommended procedure for reworking (connector removal, site cleaning,
and connector replacement) Samtec’s SEARAY
TM
SEAF8-RA connectors using hot air rework equipment.
Equipment Used:
Air-Vac DRS27 BGA/SMT rework machine
Air-Vac NT805XD2191S hot air rework nozzle
Other Materials:
SEAF8-50-01-S-10-2-RA-GP connector
Alpha OM-338 Pb-free, no-clean solder paste
Kester TSF-6522 no-clean rework flux
Mini-stencil
PCB thickness .093
______________________________________
Thermal Profiling
Prior to each process, a complete thermal profile
study shall be completed. Thermocouples shall
be placed directly beneath the center of the
component as well as on the insulator body. The
ideal process will replicate the temperature
gradient and ramp rate as recommended by the
solder paste manufacturer.
Figure 1. Thermocouple Placement
Process 1 – Connector Removal
Place board to be reworked on hot air
rework machine.
Figure 2. Board Placed on Rework Machine
Align nozzle over component.
If possible, apply tacky flux to solder joints
along each side of the connector.
Figure 3. Flux Application
Reworking SEARAY
TM
SEAF8-RA Connectors
©Samtec, Inc. Phone: 1-800-SAMTEC-9 Rev.: A
www.samtec.com 812-944-6733 Date: April 14, 2017
Page: 2 Email: info@samtec.com Created by: Lance Cooper
Run connector removal heating program.
Figure 4. De-soldering Process - Nozzle in Down Position
* Customer settings may be different
After (removal) heating program is complete,
quickly remove connector as nozzle rises.
Figure 5. Connector Removal
Process 2 – Site Cleaning
Apply tacky flux to area to be site-cleaned.
Figure 6. Flux Application
Run site cleaning thermal program.
(Once site-cleaning nozzle is lowered,
manually adjust table location until all pads
have been cleaned, resulting in a flat
surface with a thin coating of solder.)
If a site cleaning feature is not available, a
manual site cleaning process is required.
* Customer settings may be different
Figure 7. Site-Cleaning
Samtec Removal Program Settings*
Pre-heat board to 140°C
- Bottom heater – 325°C
Pre-soak
- Z-axis hot gas heater – 245°C, 85% flow
- Bottom heater – 300°C for 30 seconds
Soak
- Z-axis hot gas heater – 275°C, 85% flow
- Bottom heater – 300°C for 30 seconds
Ramp
- Z-axis hot gas heater – 300°C, 85% flow
- Bottom heater – 300°C for 20 seconds
Reflow
- Z-axis hot gas heater – 325°C, 85% flow
- Bottom heater – 300°C for 70 seconds
Samtec Site Clean Program Settings*
Pre-heat board to 130°C
- Bottom heater – 300°C
Site Clean
- Z-axis hot gas heater – 460°C, 60% flow
- Bottom heater – 300°C