Piezo-electric Devices
Precaution Usage
Token Electronics Industry Co., Ltd.
Taiwan: No.137, Sec. 1, Zhongxing Rd., Wugu District,
New Taipei City, Taiwan, R.O.C. 24872
Tel: +886 2981 0109 Fax: +886 2988 7487
China: 12F, Zhong Xing Industry Bld., Chuang Ye Road,
Nan Shan District, Shen Zhen City,
Guang Dong, China 518054
Tel: +86 755 26055363; Fax: +86 755 26055365
Web: www.token.com.tw
Email: rfq@token.com.tw
Version:
January 16, 2017
Taiwan Factory: +886 2 29810109
http://www.token.com.tw
rfq@token.com.tw
China Factory: +86 755 26055363
Page: 1/5
Resonator General Usages
Chip Type Resonator Soldering Conditions
Reflow Solderings of Chip Type Ceramic Resonator
1. Reflow
One heat stress, shown in the profile at right, is applied to resonator, then after being placed in
natural conditions for 1 hour, the resonator is measured.
a. Pre-heating conditions should be +150 to +180℃ for 60 to 120 seconds. Ascending
time up to +150℃ should be longer than 30 seconds.
b. Heating conditions should be within 40 seconds at +230℃ min., but peak temperature
should be lower than +260℃.
2. Soldering Iron
Soldering iron of +300±5℃ should be placed 0.5mm above electrode of resonator. Melting
solder through soldering iron should be applied to electrode for 3±1 seconds; then, after being
placed in natural conditions for 24 hour, the resonator should be measured.
Wash
Please contact us in case you need washable component.
Notice for Mounting
1. The component is recommended for use with placement machines which employ optical
placement capabilities. The component might be damaged by excessive mechanical force.
Please make sure to evaluate by using placement machines before going into mass production.
Do not use placement machines which utilize mechanical positioning. Please contact Token for
details beforehand.
2. Please insure the component is thoroughly evaluated in your application circuit.
3. Please do not apply excess mechanical stress to the component and terminals during soldering.