IQ Switch
®
ProxSense
®
Series
Copyright © Azoteq (Pty) Ltd 2019.
IQS5xx-B000 Datasheet
Page 1 of 4
All Rights Reserved.
Revision 2.1
September 2019
Azoteq
AZOTEQ PRODUCT CHANGE NOTICE: IQS550
All product assembly has been transferred from primary assembly plant to the
secondary site for the IQS550 QFN(7x7)-48 device.
Internal Assessment Date: March 2017
External Issued Date: August 2018
Effective Date: July 2017
PCN Number: ACN_IQS550_01
1 Azoteq Change Notification Policy
Azoteq appreciates that our customers often have long product life cycles. As Azoteq values our
customers’ needs, we try to keep our products in production for as long as possible. There are,
however, legal, environmental or performance requirements that will sometimes necessitate the
need for a running change to a part. We weigh this very carefully against the inconvenience caused
to customers already in production.
The impact and implications of all changes described in our change notification has been thoroughly
evaluated by Azoteq to maintain our standards of quality.
We have previously reviewed and accepted this product change internally, and with no impact to
customer this running change was approved.
Having updated our Quality System to ISO:2015, we feel the need to disclose these minor updates
by means of this PCN to customers.
2 Detailed Description of Changes
From June 2017 all IQS550 products have been manufactured exclusively at our second source IC
assembly site. This pre-approved assembly site is the same outsourced semiconductor and test
(OSAT) company as used for the primary source assembly site.
Manufacturing details (such as lead finish, mold compound and die attach glue) have been kept
identical to ensure continuity with the primary assembly site. The wire bond material has however
been updated.
This change is classified as a minor change, with no change in fit, function, reliability or process
ability.
2.1 Part Number Description Change
No change.
2.2 Software Change
No change.
IQ Switch
®
ProxSense
®
Series
Copyright © Azoteq (Pty) Ltd 2019.
IQS5xx-B000 Datasheet
Page 2 of 4
All Rights Reserved.
Revision 2.1
September 2019
Azoteq
2.3 Internal Hardware Changes
The bond wires were updated as follows:
Table 2.1 Bond Wire Change
To
0.8 mil 96.5% Ag
2.4 External Hardware (Mechanical) Changes
Traceability is maintained by means of an update to the IC marking.
Table 2.2 IQS550 IC Marking Update
From
To
Assembly plant marking (B below) was GH
Assembly plant marking (B below)
A quality improvement has furthermore been implemented by using an enhanced lead frame
implementation:
> Down-bonds / ground-bonds secured by groove
> Better lead shape for sawing robustness due to better neck design
This has no impact on PCB footprint and customer PCB.