RS358A
REV A.1
1
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1.1MHz, Precision, Rail-to-Rail I/O
CMOS Operational Amplifier
FEATURES
HIGH GAIN BANDWIDTH:1.1MHz
RAIL-TO-RAIL INPUT AND OUTPUT
±4.5mV Max Vos
INPUT VOLTAGE RANGE: -0.1V to +5.6V
with Vs = 5.5V
SUPPLY RANGE: +2.5V to +5.5V
SPECIFIED UP TO +125°C
Micro SIZE PACKAGES: SOIC-8
APPLICATIONS
SENSORS
PHOTODIODE AMPLIFICATION
ACTIVE FILTERS
TEST EQUIPMENT
DRIVING A/D CONVERTERS
OUT A
-IN A
+IN A
V-
B
A
RS358A
1
2
3
4
6
7
8
5
SOIC-8(SOP8),MSOP-8,TSSOP-8
+
+
V+
OUTB
-IN B
+IN B
RS358A
2
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ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, V+ to V-...............................................7.0V
Input Terminals, Voltage
(2)
…………... 0.5 to (V+) + 0.5V
Current
(2)
…………………....….....±10mA
Storage Temperature …….…………… 65°C to +150°C
Operating Temperature ……….……… 40°C to +125°C
Junction Temperature................................................150°C
Package Thermal Resistance @ TA = +25°C
SOT23-5, SOT23-6………………….………………20C/W
MSOP-10, SOIC-8, TSSOP-8.……….…………... 150°C/W
SOIC-14, TSSOP-14……….……….……………100°C/W
Lead Temperature (Soldering, 10s) …………........260°C
ESD Susceptibility
HBM …......................................................................3000V
MM …………………….........………………...…….200V
(1) Stresses above these ratings may cause permanent damage. Exposure
to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those
specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input
signals that can swing more than 0.5V beyond the supply rails should
be current-limited to 10mA or less.
PACKAGE/ORDERING INFORMATION
PRODUCT
ORDERING
NUMBER
TEMPERATURE
RANGE
PACKAGE
LEAD
PACKAGE
MARKING
PACKAGE OPTION
RS358A
RS358AXK
-40~125
SOIC-8(SOP8)
RS358A
Tape and Reel,2500
RS358AXM
-40~125
MSOP-8
RS358A
Tape and Reel,3000
RS358AXQ
-40~125
TSSOP-8
RS358A
Tape and Reel,3000
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes
could cause the device not to meet its published
specifications.
ESD SENSITIVITY CAUTION