© Won-Top Electronics Co., Ltd. www.wontop.com
Revision: October, 2018 1
Pb
Features
Planar Die Construction
200mW Power Dissipation
A
2.0V – 51V Nominal Zener Voltage
5% Standard Vz Tolerance
Designed for Surface Mount Application
C
Plastic Material – UL Recognition Flammability D
Classification 94V-0
B
E
Mechanical Data H
Case: SOD-323, Molded Plastic G
Terminals: Plated Leads Solderable per J
MIL-STD-202, Method 208
Polarity: Cathode Band
Weight: 0.004 grams (approx.)
Marking: Device Code
Lead Free: For RoHS / Lead Free Version,
Add “-LF” Suffix to Part Number, See Page 5
Maximum Ratings @T
A
=25°C unless otherwise specified
Characteristic Symbol Value Unit
Power Dissipation at T
A
= 25°C (Note 1) PD 200 mW
Forward Voltage @ IF = 10mA VF 0.9 V
Thermal Resistance, Junction to Ambient (Note 1, 2) RθJA 625 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C
Note: 1. Mounted on FR-4 PCB with minimum recommended pad layout.
2. Thermal resistance measurement obtained via infrared scan method.
BZT52C2V0S – BZT52C51S
200mW SURFACE MOUNT ZENER DIODE
WON-TOP ELECTRONICS
®
SOD-323
Dim Min Max
A 2.30 2.75
B 1.60 1.80
C 1.20 1.40
D 0.25 0.40
E 0.05 0.15
G 0.20 0.40
H — 1.10
J — 0.10
All Dimensions in mm
www.wontop.com © Won-Top Electronics Co., Ltd.
2 Revision: October, 2018
BZT52C2V0S – BZT52C51S
WON-TOP ELECTRONICS
®
0
T
A
, AMBIENT TEMPERA TURE (°C)
Fig. 1 Power Derating Curve
25 50 75 100 125 150
0
0.1
0.2
0.3
0.4
0.5
V
Z
, ZENER VOLTAGE (V)
Fig. 2 Zener Breakdown Characteristics
I
Z
, ZENER CURRENT (mA)
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Zener Breakdown Characteristics
I
Z
, ZENER CURRENT (mA)
V
Z
, ZENER VOLTAGE (V)
Fig. 4 Zener Breakdown Characteristics
I
Z
, ZENER CURRENT (mA)
0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 5 Typical Forward Characteristics
0.4 0.6 0.8
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 6 Junction Capacitance vs. Nominal Zener Voltage
10
100
1000
C
J
, JUNCTION CAPACITANCE (pF)
0.2 1.0
010
0
5
10
15
20
0 5 10 15 20 25 30 35 40 45 50
0
5
10
15
20
25
P
D
, POWER DISSIPATION (W)
246 8 9135 7
5V6
6V2
6V8
7V5
8V2
9V1
2V0
2V4
2V7
3V0
3V3
3V6
3V9
4V3
4V7
5V1
Test Current I
Z
5mA
10
12
15
18
22
33
27
36
0
2
4
6
8
10
0 10 20 30 40 50 60 70 80 90 100
39
43
47
51
Test Current I
Z
5mA
1
10
100
1000
T
J
= 100°C
T
J
= 25°C
Mounted on FR-4 PCB with
Minimum Recommended
Pad Layout
1 10 100
T
J
= 25°C
f = 1MHz
V
R
= 1V
V
R
= 2V
V
R
= 1V
V
R
= 2V
T
J
= 25°C
T
J
= 25°C T
J
= 25°C
Test Current I
Z
5mA
Test Current I
Z
5mA
Test Current I
Z
5mA