TECHNICAL DATA SHEET
Page 1 of 2
• Tube-In-Plate (Ex. in Figure 1)
o Copper, Copper/Nickel, Stainless Tubing
o Aluminum or Copper Plates typical
o Soldered, Epoxied, or dip-brazed into
extruded or machined plate channels
• Aluminum Vacuum-Brazed (Ex. in Figure 2)
o Aluminum construction throughout
o Machined fins or folded fin packs
o Machined or welded fluid connections
• Micro-Channel (Ex. in Figure 3)
o Aluminum or Copper Construction
o Micro-channels
o Brazed, machined, or welded fluid
connections
• Micro-Channels
• Folded Fins (>70 fins per inch possible)
• Porous metal
Liquid Cold Plate Design
• Thermal Analysis using FEA and CFD
• Internal geometry optimized to achieve
required thermal performance with
minimal pressure drop
• Real-world thermal and hydraulic
performance validation in a controlled
laboratory setting
LEGACY: Liquid Cooled Cold Plates
Figure 2.
Aluminum Vacuum Brazed Liquid Cold Plates
Figure 1.
Tube-In Plate Liquid Cooled Cold Plate
Figure 3. Micro Channel Cold Plate Base
Aavid, Thermal Division of Boyd Corporation's legacy
liquid cooled cold plates are custom designed to meet an
application's unique thermal and mechanical
requirements. To satisfy critical thermal management
needs in applications as diverse as military/aerospace,
medical/test equipment, power electronics, lasers,
renewable energy and transportation, these liquid cooled
cold plates provide the top performance and reliability
designer’s trust.
Custom liquid cooled cold plate options offer high
performance cooling for demanding applications with high
heat fluxes and power/heat loads. This small sample of
Aavid's liquid cooled cold plate technologies allow the
thermal designer to liquid cool high flux, high heat load
devices such as IGBT/SGCT’s, SCR’s, Thyristers, RF,
and other power electronic devices. For more information
on custom liquid cooling please contact us.
Li
quid Cooled Cold Plate Construction Options
Legacy Liquid Cooled Cold Plate options include:
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©
Boyd Corporation 2020. All rights
reserved.
Subject to change without notice
C
old Plate Internal Technology
The key to high performance Liquid Cooled Cold Plates
is the variety of internal flow channel technologies.
Sele
ct from the following technologies to optimize
performance for a specific application:
TECHNICAL D AT A SHEET
Page 2 of 2
Industry Leading Thermal Performance
• Lower Electronic Device Case Temperatures
• Lower System Thermal Resistance
• Multiple Heat Source, Heat Consolidation, and Remote
Cooling
• Heat Spreadi ng and “Isothe rmalization”
High Heat Load and Flux Capability
• Increased System Level Cooling Capacity
• Increased Electronic Device Performance
• High Heat Flux (>100W/cm
2
)
• High Heat Load (>20kW+)
Scalable Cold Plate Technology
• 3 Internal Configuration Options
o Micro-Channel or Vertical Fin Cold Plate
o High Density Folded-Fin
o Advanced Porous Metal Col d Plate
• k-Core
®
APG and/or Heat Pip e Enh anc ement Options
• Next generation needs met without significant redesign
costs
Increased Life and Reliability
• Increased Electronic Device Life
• Leak Free Performance
• Corrosion Resistance Coatings
Criti c a l Applic a t ion Needs
Military/Aerospace Electronics Cooling
Power Electronics Cooling
Medical/Test Equipment Cooling
Battery Cooling
Computer CPU and GPU Cooling
Table 1. Cold Plate Fluid Compatibility
Cold Plate Technology Water
Glycol-Water
Mix
De-ionized
Water
Oil
Dielectric
Fluids
PAO
(Polyalphaolefin
Copper Tube-In Cold Plate
Copper-Nick el Tube-In Cold Plate
���
Brazed “Microchannel” Copper Cold Plate
Brazed “Powder Metal” Copper Cold Plate
Stainless Steel Tube-In Cold Plate
Aluminum Vacuum Brazed Cold Plates
Specifications
Specificat ions and O ptio ns - Liquid Cooled Cold Plates
Power / Heat Load
100W to >20kW
Effective Thermal Resistance
0.02 °C/W typical
Maximum Heat Fluxe s
>100W/cm
2
Cold Plate Construction
Tube-in-Plate
Vacuum Brazed
Microchannel welded or brazed
Cold Plate Technology
• Micro-Channels
• Folded Fins (>70 fpi possible)
• Porous metal
Burst/Proof Pressure*
400 psi / 2 .8 MPa
*Note: Higher Proof Pressures evaluated
on a Case-by-Case Basis.
Fluid Interconne cts
Compression fitting s
Quick Disco n n ect
Barbs per SAE-J1231
Welded/Brazed
Ma x imum S ize >3 6” x 144 ” (1m x 3. 6m)
Maximum Shock
(operating/non-operating)
40G / 75G
Other Related Technologies*
Embedded Heat Pipe
k-Core
®
Annealed Pyrolytic Graphite (APG)
VME-VPX Cold Plates
Liquid Cooling System
Ruggedized Liquid Cooling System (rLCS)
Intelligent Thermal Management System (iTMS)
Vacuum Brazements
Coolant Fluid Options:
Liquid cooled cold plates can be engineered
to perform
with diverse coolants, such as water, de-ionized
water,
water/glycol solutions, dielectric fluids, oils and
synthetic
hydrocarbons (PAO). Table 1 above provides a
summary
of cold plate material and coolant compatibility.
Key Features and Benefits
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© Boyd Corporation 2020. All rights reserved.
Subject to change without notice