10/19/18

GaAs DOUBLE-BALANCED MIXER MM1-0320H

Features

 Compact Chip Style Package (0.058” x 0.046”x0.004”)

 CAD Optimized for Superior Isolation and Spurious Response

 Broadband Performance

 Excellent Unit-to-Unit Repeatability

 Fully nonlinear software models available with Marki PDK for Microwave Office®

 RoHS Compliant

Electrical Specifications - Specifications guaranteed from -55 to +100C, measured in a 50Ω system.

Specifications are shown for Configurations A (B). See page 2 for port locations.

All bare die are 100% DC tested and 100% visual inspected. RF testing is performed

on a sample basis to verify conformance to datasheet guaranteed specifications.

Consult factory for more information.

Parameter

Min

Typ

Max

LO drive level (dBm)

(GHz)

Conversion Loss

3.5-20

DC-4

8 (9)

13 (16)

Isolation (dB)

LO-RF

See

LO-IF

Plots

RF-IF

Input 1 dB Compression (dBm)

Config. A: +13 to +20

Config. B: +12 to +17

Input Two-Tone Third Order

Intercept Point (dBm)

+20

Config. A: +13 to +20

+20

Config. B: +12 to +17

Part Number Options

Please specify diode level and package style by adding to model number.

Package Styles

Examples

Connectorized

1, 3

MM1-0320HCH-2, MM1-0320HS

Chip

2, 3

(RoHS)

CH-2

MM1-0320

(Model)

(Diode Option)

CH-2

(Package)

Connectorized package consists of chip package wire bonded to a substrate, equivalent to an evaluation board.

Chip package connects to external circuit through wire bondable gold pads.

Note: For port locations and I/O designations, refer to the drawings on page 2 of this document.

215 Vineyard Court, Morgan Hill, CA 95037 | Ph: 408.778.4200 | Fax 408.778.4300 | info@markimicrowave.com

The MM1-0320H is a passive double balanced MMIC mixer. It

features excellent conversion loss, superior isolations and

spurious performance across a broad bandwidth, in a highly

miniaturized form factor. Accurate, nonlinear simulation

models are available for Microwave Office® through the Marki

Microwave PDK. The MM1-0320H is available as a wire

bondable chip or an SMA connectorized package. The MM1-

0320H is a superior alternative to Marki Microwave carrier and

packaged M1 and M3 mixers.

10/19/18

GaAs DOUBLE-BALANCED MIXER

MM1-0320H

Page 2

LO/RF 3.5 to 20 GHz

IF DC to 4 GHz

1. Configuration A/B refer to the same part number (MM1-0320H) used in one of two different ways for optimal spurious performance. For the

lowest conversion loss, use the mixer in Configuration A (port 1 as the LO input, port 3 as the RF input or output). If you need to use a lower

LO drive, use the mixer in Configuration B (port 1 as the RF input or output, port 3 as the LO input). For optimal spurious suppression,

experimentation or simulation is required to choose between Configuration A and B. For more information, see here.

1. CH Substrate material is .004 thick GaAs.

2. I/O traces and ground plane finish are 2 microns Au.

3. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage

temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the

minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or

substrate. All bonds should be as short as possible <0.31 mm (12 mils).

MM10320H

Configuration A

LO 1

Function

Port Number

Configuration B

Port Number

Note: S-Package Connectors are not removeable

Connector

SMA Female

Type

Ø.067 Thru, 4 PL

[5.0]

.20

[1.70]

[7.11]

.280

[6.60]

.260

[13.21]

.520

[11.07]

.436

[1.07]

.042

[4.06]

.160

.560

[6.10]

[14.22]

.240

.06 Rad

4 PL

[1.5]

PROJECTION

[MM]

INCH

D/C

1 3

[9.9]

.39

XX=±.01

XXX=±.005