MICROLITHIC™ DOUBLE-BALANCED MIXER ML1-1040
Page 1
215 Vineyard Court, Morgan Hill, CA 95037 | Ph: 408.778.4200 | Fax 408.778.4300 | info@markimicrowave.com
8/26/19
Features
Compact Chip Style Package (0.152” x 0.090” x 0.010”)
CAD Optimized for Superior Isolation and Spurious Response
Broadband Performance
Excellent Unit-to-Unit Repeatability
Fully nonlinear software models available with Marki PDK for Microwave Office
RoHS Compliant
Electrical Specifications - Specifications guaranteed from -55 to +100C, measured in a 50Ω system.
Specifications are shown for Configurations A (B). See page 2 for port locations.
All bare die are 100% DC tested and 100% visually inspected. RF testing is performed
on a sample basis to verify conformance to datasheet guaranteed specifications.
Consult factory for more information.
Parameter
LO
RF
IF
Min
Typ
Max
LO drive level (dBm)
(GHz)
(GHz)
(GHz)
Conversion Loss (dB)
1
10-40
10-40
8
13.5
11
16.5
Isolation (dB)
LO-RF
See
LO-IF
Plots
RF-IF
Input 1 dB Compression (dBm)
+3
L (+10 to +13)
+9
I (+15 to +19)
Input Two-Tone Third Order
Intercept Point (dBm)
2
+15
L (+10 to +13)
+21
I (+15 to +19)
1
Measured Conversion Loss measured at 91 MHz fixed IF
2
IP3 depends on LO drive conditions, see plots for more details
Part Number Options
1
Part Number
Description
Package
Green Status
Product
Lifecycle
Export
Classification
ML1-1040LCH-2
Chip
CH
RoHS Compliant
EOL
EAR99
ML1-1040ICH-2
Chip
CH
ML1-1040LS
Connectorized
S
ML1-1040IS
Connectorized
S
1
Refer to our website for a list of definitions for terminology presented in this table.
The ML1-1040 is a Microlithic™ double balanced mixer. As with all
Microlithic™ mixers (patent pending), it features excellent conversion
loss, isolations, and spurious performance across a broad bandwidth and
in a miniaturized form factor. Accurate, nonlinear software models are
available for Microwave Office through the Marki Microwave PDK. The
ML1-1040 is available as a wire bondable chip or in a connectorized
package. The ML1-1040 is an excellent alternative to Marki Microwave
M9 mixers packaged in drop-in carriers such as the ES carrier.
MICROLITHIC™ DOUBLE-BALANCED MIXER ML1-1040
Page 2
215 Vineyard Court, Morgan Hill, CA 95037 | Ph: 408.778.4200 | Fax 408.778.4300 | info@markimicrowave.com
8/26/19
1. CH Substrate material is .010 thick Ceramic.
2. I/O traces and ground plane finish is 2.5 microns Au over .05 microns WTi.
3. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the
minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31 mm (12 mils).
.010
[.25]
.005 min
clearance
[.13]
.086
.148
[3.76]
[2.18]
[MM]
INCH
PROJECTION
XX=±.01
XXX=±.003
CH-1 Option
.152
.090
.110
.005 sq. minimum
bonding pad, 3 PL
Ground pad,
6 PL
[2.29]
[2.79]
[3.86]
L
I
R
.042
[1.07]
.045
[1.14]
L
I
R
CH-2 Option