Everspin SOIC MRAM Package Guide

Everspin SOIC MRAM Package Guide Revision 2.2, 3/2018

• Compliant with RoHS, REACH regulations and practices.

• Contain no Red Phosphorus.

• Lead Free.

• All products meet MSL-3 moisture sensitivity level.

• Standard Reow prole.

• Compatible with similar low-power SRAM products and other nonvolatile RAM products.

SOIC PACKAGE

RoHS

TABLE OF CONTENTS

COMPLIANCE WITH ENVIRONMENTAL REGULATIONS AND DIRECTIVES ........................................................2

Table 1 – Environmental Regulation and Directive Compliance ................................................................. 2

MULTIPLE REFLOW CYCLES AND MOISTURE RESISTANCE .....................................................................................2

RECOMMENDED REFLOW TEMPERATURES AND TIMING .......................................................................................3

Figure 1 – JEDEC J-STD-020D.1 Assembly Reow Prole ............................................................................... 3

Table 2 – Recommended Reow Times and Temperatures - All Packages ............................................. 3

THERMAL RESISTANCE ..........................................................................................................................................................4

Table 3 – Thermal Resistance 16-pin SOIC .......................................................................................................... 4

PACKAGE OUTLINE DRAWINGS .........................................................................................................................................5

Figure 2 – Package Outline 16-pin SOIC ............................................................................................................... 5

REVISION HISTORY .................................................................................................................................................................. 6

CONTACT US .............................................................................................................................................................................. 7

16-pin SOIC

Everspin SOIC MRAM Package Guide

Everspin SOIC MRAM Package Guide Revision 2.2, 3/2018

Environment Statement Summary

Download Full State-

ment

ISO9001:2008

Everspin Technologies is in conformance with

ISO9001:2008

Certicate

RoHS Directives

Statement of RoHS 1 and the recast Directive 2011/65/EU is

commonly referred to as RoHS 2 Compliance. Everspin MRAM

products are also “halogen-free”.

Full Statement

REACH Regula-

tions

REACH regulations require article suppliers to inform recipi-

ents if an article contains a Substance of Very High Concern

(SVHC) in excess of 0.1% by weight.

Based on the material content certications provided by

Everspin’s suppliers, none of these substances are present in

the materials we use in our products, including packing and

shipping materials.

Full Statement

Red Phosphorus

Everspin Technologies, Inc. MRAM products do not contain

Red Phosphorus CAS# 7723-14-0 as an intentional additive.

Full Statement

Table 1 – Environmental Regulation and Directive Compliance

COMPLIANCE WITH ENVIRONMENTAL REGULATIONS AND DIRECTIVES

MULTIPLE REFLOW CYCLES AND MOISTURE RESISTANCE

All Everspin packages are qualied by the procedure dened in IPC/JEDEC joint specication IPC/JEDEC

J-STD-020D.1. They are guaranteed to withstand up to three reow cycles without permanent damage, pro-

vided the conditions for the rated moisture resistance level for the part are observed prior to reow.

Everspin parts are generally rated for MSL Level 3. Exceptions may exist and are noted in their respective

data sheet. Please the check the latest individual product data sheet to conrm the rated MSL for the prod-

uct.