Table of Contents

Introduction..................................................................................................................................2

PCB Layout and Design .........................................................................................................2

Storage and Baking..................................................................................................................3

Stencil Design .............................................................................................................................3

Surface Mounting Guidelines ..............................................................................................3

Reflow Recommendations ...................................................................................................3

Post Reflow Cleaning .............................................................................................................4

Rework Guidelines....................................................................................................................4

References....................................................................................................................................7

This Application Note discusses optimization of the

layout and mounting recommendations

for Pulse's BGA devices. Topics discussed include PCB layout placement, soldering,

pick-and-place, reflow, cleaning, and reworking recommendations.

ecommended Design, Integration,

and Rework Guidelines f

or Pulse’s

BGA

Package

ICATION NOTE

HJ606.C (03/19)1

Networking.PulseElectronics.com

APPLICATION NOTE:

Recommended Design, Integration, and Rework

of Guidelines for Pulse’s BGA Package

Introduction

Pulse's BGA (Bump Grid Array) devices are high

performance microelectronic devices designed to

provide efficient and reliable operation. This

application note discusses optimization of the

layout and mounting recommendations for these

devices. Topics include PCB layout, placement,

soldering, pick-and-place, reflow, cleaning, and

rework recommendations, which are provided to

ensure that performance and reliability are not

compromised.

1.0 PCB Layout and Design

To achieve maximum reliability and optimum

electrical performance, the design of the PCB onto

which the device is mounted should be considered.

Specifically, the PCB routing, solder mask opening

design, and termination should follow these

guidelines.

1.1 PCB Routing and Land Pad Design

The PCB to which the devices are attached should

meet the IPC-A-610 specifications. Figure 1 shows

an example of the recommended pad and via

design. As shown in this figure, Pulse recommends

the use of NSMD (Non-Solder Mask Defined) pads

for BGA lands. However, the use of SMD (Solder

Mask Defined) pads would also be acceptable. The

use of NSMD pads will provide the best reliability

and electrical performance. Figure 2 shows the

differences between SMD pads and NSMD pads.

It is recommended that the land pads on the

motherboard should be Non-Solder Mask

Defined. For Pulse BGA devices, the required

land pad is 0.762mm in diameter (Figure 3).

This diameter provides the optimum stand-

off height and performance reliability.

Figure 2. Comparison between solder mask defined pad

and non- solder mask defined pad.

Figure 3. Recommend Land Pad for BGA device

1.2 Plating

For Pulse Lead-Free devices, it is

recommended to use electrolytic nickel/gold or

tin termination on the PCB. For Pulse Leaded

devices, gold, tin, or HASL (Hot-Air Solder

Leveling) terminations are recommended,

although most other terminations are also

acceptable. If using gold termination, a

minimum of 5.0 microns of a nickel layer should

be used as a barrier, and the gold should be

0.5-1.2 microns thick. It is strongly

recommended that the gold thickness does not

exceed 1.2 microns. If using tin finish, either

white tin or 100% tin is acceptable.

Figure 1. Recommended PCB copper pattern for mounting

Pulse BGA device.

PCB

Pulses BGA Device

HJ606.C (03/19)2

Networking.PulseElectronics.com