Solution Highlights

Advanced 802.11ac combo SoC

Advanced 802.11ac features such as MU-MIMO and TX

Beamformee to increase network capacity, as well as

maximal likelihood (ML) decoding, low-density parity

check (LDPC), maximum ratio combining (MRC) for

robust link connection.

Internal 5GHz PA with enhanced

transmit power

enhanced Wi-Fi/Bluetooth coexistence by allowing

Wi-Fi and Bluetooth to operate virtually concurrently.

QFN Package for low cost solution

The QCA9379 QFN package can be mounted on

4-layer non-HDI PCB, plus low BOM (Build of Material)

to provide an overall cost-effective solution.

High performance 2x2 dual-band 802.11ac

Wi-Fi with MU-MIMO and

Bluetooth

®

4.2

radios in a single-chip solution.

Wi-Fi/Bluetooth co-existence with dedicated

(third) antenna for Bluetooth.

Designed to deliver seamless integration

of WLAN and Bluetooth Low Energy (LE)

technology in a single-chip solution, the

QCA9379 SoC oers both low power dual-

band (2.4 & 5GHz), 2-stream (2x2), 802.11ac

MU-MIMO and Bluetooth 4.2 technologies.

QCA9379 allows for superior rate-over-range

throughput and low-latency performance

Bluetooth to operate virtually concurrently.

There are three variants available for

QCA9379:

(w/L1 substrate) interface for WLAN and

UART/PCM interface for Bluetooth.

3.0 interface for WLAN and UART/PCM

2x2 802.11ac + Bluetooth 4.2 in a

single SoC

Supports Bluetooth 4.2, Bluetooth low

Integrated RF Front End

Single regulated 3.3V supply operation

Advanced 11ac features: MU-MIMO,

Transmit Beamformee

density parity check (LDPC), maximum

ratio combining (MRC) for robust link

Package DRQFN-129 10x10

Process Node 40nm

Interfaces QCA9379-1

WLAN: PCIe P2.1 (w/L1 substrate)

Bluetooth: HS-UART/PCM

QCA9379-3

WLAN: SDIO 3.0

WLAN TCP/IP Throughput 620Mbps/600Mbps TCP DL/UL (PCIe2.1)

Power Supply 3.3V power supply and 1.8V or 3.3V I/O supply

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