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Notes:
1. -2LE (Tj = 0°C to 110°C). For more details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview.
2. Maximum achievable performance is device and package dependent; consult the associated data sheet for details.
3. For full part number details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview.
4. GTY transceiver line rates are package limited: B784 to 12.5 Gb/s; A676, D900, and A1156 to 16.3 Gb/s. Refer to data sheet for details.
5. The B784 package is only offered in 0.8mm ball pitch. All other packages are 1.0mm ball pitch.
KU3P KU5P KU9P KU11P KU13P KU15P
Logic
356 475 600 653 747 1,143
CLB Flip-
325 434 548 597 683 1,045
CLB
163 217 274 299 341 523
Memory
Max. Distributed RAM
12.7 16.9 32.1 21.1 26.2 34.6
UltraRAM
13.5 18.0 0 22.5 31.5 36.0
Clocking Clock Mgmt
1,368 1,824 2,520 2,928 3,528 1,968
PCIe®
0 0 0 1 0 4
100G Ethernet w/RS-
0 1 0 2 0 4
I/O
Max. Single-
96 96 96 96 96 96
Max. Single-
208 208 208 416 208 572
GTH 16.3Gb/s
0 0 28 32 28 44
GTY 32.75Gb/s
-1 -2 -2L -3 -1 -2 -2L -3 -1 -2 -2L -3 -1 -2 -2L -3 -1 -2 -2L -3 -1 -2 -2L -3
-1 -1L -2 -1 -1L -2 -1 -1L -2 -1 -1L -2 -1 -1L -2 -1 -1L -2
Footprint
(2, 3)
HD I/O, HP I/O, GTH 16.3Gb/s, GTY 32.75Gb/s
Footprint compatible with 20nm
UltraScale Devices with same
footprint identifier
B784
(4)
23x23
(5)
96, 208, 0, 16 96, 208, 0, 16
A676
(4)
27x27 48, 208, 0, 16 48, 208, 0, 16
B676 27x27 72, 208, 0, 16 72, 208, 0, 16
D900
(4)
31x31 96, 208, 0, 16 96, 208, 0, 16 96, 312, 16, 0
E900 31x31 96, 208, 28, 0
A1156
(4)
35x35 48, 416, 20, 8 48, 468, 20, 8
E1517 40x40
Kintex
® UltraScale+™ FPGAs