© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1095_MIL-PRF-32535 • 5/7/2018 1
One world. One KEMET
Benets
• Patented BME technology
• QualiedperMIL-PRF-32535(QPL)
• Standardreliability(MLevel)
• Highreliability(TLevel)
• Flexible termination option available
• EIA 0402, 0603, 0805, 1206, 1210, 1812, 2220 case sizes
• DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 50 V,
100 V and 200 V
• Capacitance offerings ranging from 1.0 pF up to 180 nF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, and 10%
• No piezoelectric noise
• Extremely low ESR and ESL
• High ripple current capability
• Preferred capacitance solution at line frequencies and
into the MHz range
• No capacitance change with respect to applied rated DC
voltage
• Negligible capacitance change with respect to
temperaturefrom−55°Cto+125°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
Overview
The KEMET MIL-PRF-32535 C0G and BP surface mount
capacitors are designed, tested and screened to meet
demanding high reliability defense and aerospace
applications. MIL-PRF-32535 is Defense Logistics Agency's
(DLA)rstcapacitorspecicationfordefenseand
aerospace that capitalizes on industry leading base metal
electrode(BME)technology.Qualiedunderperformance
specicationMIL-PRF-32535andQPLlisted,thisseries
meets or exceeds the requirements outlined by DLA and
iscurrentlyavailableinM(standardreliability)andT��(high
reliability)productlevels.Drivenbythedemandforhigher
capacitance and smaller case size MLCCs in high reliability
applications, KEMET’s MIL-PRF-32535 C0G and BP
provides over an 18-fold increase in capacitance over MIL-
PRF-55681 and MIL-PRF-123, allowing for reduced board
space and continuing the trend for miniaturization.
InadditiontobeingtherstBMEC0GandBPdielectric
qualiedforuseindefenseandaerospaceapplications,
MIL-PRF-32535istherstDLAspecicationtorecognize
aexibleterminationoption.KEMET'sexibletermination
utilizes a pliable and conductive silver epoxy between the
base metal and nickel barrier layers of the termination
system. The addition of this epoxy layer inhibits the transfer
of board stress to the rigid ceramic body, therefore mitigating
excracks,whichcanresultinalowIRorshortcircuit
failures..
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
High Reliability Surface Mount Capacitors,
MIL-PRF-32535, 4 – 200 VDC (C0G and BP Dielectrics)
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