IDT Wafer Dicing Guidelines

April 1, 2016

Introduction

This guideline describes the requirements for dicing wafers manufactured by IDT. It applies to both IDT internal

sawing operations and to sawing procedures used by customers purchasing un-sawn wafers. Failure to follow

these guidelines could result in lower yields and immediate or delayed operational failures including data loss –

particularly failures related to EEPROM data retention.

Disclaim er: T hese dicin g pr actices are ind ustr y standa rd norm s . IDT is not respo ns ible for issues related t o di cing

performed by wafer sawing service providers; it is the responsibility of the customer or subcontractor to ensure

adherence to industry standards.

1 Dicing Guidelines

These industry standard guidelines must be followed for dicing IDT products:

• Dicing equipment and all related infrastructure used during sawing processes must meet the common ESD

safety standards of the semiconductor industry.

• Ionizers must be installed in areas where sawing processes are completed.

• Important Recommendation: The resistivity of water used for sawing or assembly (after CO

bubbler) must

be ≤ 0.5 MΩ cm. (IDT requirements exceed the industry standard. The industry standard is approximately

Ω cm.)

• Use contactless wafer mounting.

• Use UV tape if die size < 1mm x 1mm.

• If using a step cut sawing mode, use a double-spindle sawing machine.

IDT Wafer Dicing Guidelines

April 1, 2016

2 Relat e d Docum e nts

For product-specific die dimensions and additional important information, please submit a support request at

www.IDT.com/go/support

Visit the pr oduct page for the specific IDT IC o n IDT’s websit e www.IDT.com or contact your nearest sales office

for the latest version of this document and the product’s data sheet.

Note: For some products, special precautions are needed before sawing to preserve EEPROM settings. In this

case, the recommended procedures are documented in the product’s data sheet.

3 Document Revi s ion Hist ory

Revision Date Description

1.00 September 11, 2009 First release of document

1.10 November 15, 2013 Addition of requirements for contactless wafer mounting and UV tape.

Addition of equipment requirements when using step cut sawing mode.

Update for contact information and imagery for cover and headings.

Addition of “Related Documents” section.

April 1, 2016 Changed to IDT branding.

Corporate Headquarters

6024 Silver Creek Valley Road

San Jose, CA 95138

www.IDT.com

Sales

1-800-345-7015 or 408-284-8200

Fax: 408-284-2775

www.IDT.com/go/sales

Tech Support

www.IDT.com/go/support

DISCLAIM ER Integrated Device Techn ol ogy, Inc. (IDT) reserves the right to modi fy the produc ts and/ or s pecifications des c ribed herein at any time, without notic e, at IDT's sole discretion. Perform ance

specifications and operating para met ers of t he desc ribed products are determi ned i n an indepen dent state and are not guara nteed t o perform the s am e way wh en inst alled in cust omer produc ts. The

information contained herein is provided wi thout repres entation or war ranty of any kind, whether expr es s or impli ed, including, but not limited to, the suitability of IDT's products for any particul ar purpose, an

implied warranty of merchant ability, or non-infringement of t he intellectual property rights of others. This doc ument is pres ented onl y as a guide and do es not convey any license under int ellectual proper ty

rights of IDT or any third parties.

DT's products are not intended for use in applications involving ex treme envi ronme nt al conditi ons or in life support systems or simil ar devices where th e failure or malf unc tion of an IDT product c an be

reasonably ex pected to significantl y affect the health or safety of users. Anyone using an I D T product in such a mann er does so at thei r own risk, absen t an express , written agreement by IDT.

ntegrated Device Techn ol ogy, IDT and the I DT logo are trade marks or registered t rademark s of IDT and its subsidiaries in the United S tates and other countri es. Other tradem ark s us ed herei n are the

property of IDT or their respective third party owners. For datasheet t ype defi nitions and a gl ossary of commo n t erms, visit www.idt.com/go/glossary

. All contents of this document are c opyright of Integrated