Rev. P03
1
High Efficiency
DC/DC Power Module
MSN12AD12-MP
FEATURES:
High Power Density Power Module
Typical Load:10A for 0.6V ~ 2.5V
Typical Load:8A for 3.3V ~ 5.5V
Input Voltage Range from 4.5V to 16V
Output Voltage Range from 0.6V to 5.5V
94.5% Peak Efficiency at 12Vin to 3.3Vout
Protections (Non-Latch OCP, UVP, UVLO,
OTP and Latch-Off for OVP)
Differential Output Voltage Remote Sense
Programmable Soft-Start
Pre-Biased Output
Forced CCM Operation
Power Good Indication
Output Voltage Tracking
Size 8.6mm x 7.5mm x 6.5mm
Pb-free (RoHS compliant)
MSL 3, 245ºC Reflow
APPLICATIONS:
General Buck DC/DC Conversion
DC Distributed Power System
Telecom and Networking Equipments
Servers System
GENERAL DESCRIPTION:
The MSN12AD12-MP is a high frequency, high
power density and complete DC/DC power
module. The PWM controller, power MOSFETs
and most of support components are integrated
in one hybrid package.
The features of MSN12AD12-MP include
constant-on-time (COT) control mode that
provides fast transient response and eases loop
stabilization. Besides, MSN12AD12-MP is an
easy to use DC/DC power module, it only needs
input/output capacitors, one voltage dividing
resistor, one over current protection resistor
and one resistor of MODE pin to perform
properly.
The low profile and compact size enables
utilization of space on the bottom or top of PC
boards either for highly density point of load
regulation to save the space and area. It is
suitable for automated assembly by standard
surface mount equipment and complies with
Pb-free and RoHS compliance.
TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE:
FIG.1 TYPICAL APPLICATION CIRCUIT FIG.2 HIGH DENSITY POWER MODULE
8.6 mm
6.5 mm
7.5 mm
Rev. P03
2
ORDER INFORMATION:
Part Number
Ambient Temp. Range
(°C)
Package
(Pb-Free)
MSL
Note
MSN12AD12-MP
-40 ~ +85
LGA
Level 3
-
Order Code
Packing
Quantity
MSN12AD12-MP
Tape and reel
1000
ELECTRICAL SPECIFICATIONS:
CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may
adversely impact product reliability and result in failures outside of warranty.
NOTES:
1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM
condition. The test board size is 80mm× 80mm× 1.6mm with 4 layers, 2oz per layer. The test condition is complied
with JEDEC EIJ/JESD 51 Standards.
Parameter
Description
Min.
Typ.
Max.
Unit
Absolute Maximum Ratings
VIN to GND
Continuous
-
-
+18
V
SW to GND
Continuous
-0.3
-
VIN+0.3
V
VCC to GND
-
-
+4.5
V
EN to GND
Continuous
-
-
+16
V
All other pins to GND
-0.3
-
+4.3
V
Tc
Operating case temperature
-
-
+110
°C
Tj
Operating junction temperature
-40
-
+125
°C
Tstg
Storage temperature
-40
-
+125
°C
Thermal Information
Rth(jchoke-a)(1)
Thermal resistance from junction to
ambient (note 1)
-
13
-
℃/W
Recommendation Operating Ratings
VIN
Input Supply Voltage
+4.5
-
+16.0
V
VOUT
Adjusted Output Voltage
+0.6
-
+5.5
V
Ta
Ambient Temperature
-40
-
+85
°C