1/1 ASB Inc. sales@asb.co.kr Tel: +82-42-528-7225 July 2019
Declaration of RoHS-compliant Products
Part Number:
Product Name:
Package Type:
Applicable to ASF, ASL, ASW, ASX, AWB, AWG, ABB, ABU series
GaAs Amplifier
SOT89
Package Elements
Constituents
CAS No.
Weight (mg)
Active Semiconductor Die
GaAs
1303-00-0
0.302
Leadframe
Cu
7440-50-8
23.328
Fe
7439-89-6
0.023
P
7723-14-0
0.009
Ag
7440-22-4
0.014
Leadframe Plating
Sn
7440-31-5
1.400
Epoxy Molding Compound
Epoxy Resin A
Trade secret
0.976
Epoxy Resin B
29690-82-2
0.558
Phenol Resin
Trade secret
0.558
Silica(Amorphous) A
60676-86-0
23.708
Silica(Amorphous) B
7631-86-9
1.952
Carbon Black
1333-86-4
0.139
Epoxy Resin
Silver Powder
7440-22-4
0.113
Epoxy Resin
9003-36-5
0.007
Diluent A
Trade Secret
0.003
Diluent B
3101-60-8
0.003
Hardener A
Trade Secret
0.003
Hardener B
Trade Secret
0.003
Solvent
Trade Secret
0.001
Organic Peroxide
Trade Secret
0.001
Wire
Au
7440-57-5
0.038
Total
53.138
This information sheet is to declare all substances intentionally added in our SOT89 semiconductor
products. Total weight of the package varies depending on active die size. The material data is evi-
denced by written declaration from our packaging company. The products listed above DO NOT
CONTAIN intentionally added hazardous materials such as cadmium (Cd), mercury (Hg), hexavalent
chromium (Cr
6+
), polybrominated biphenyls (PBBs), polybrominated diphenylethers (PBDEs), bis(2-
ethylhexyl) phthalate (DEHP), butyl benzyl phthalate (BBP), dibutyl phthalate (DBP), and diisobutyl
phthalate (DIBP) except for 0.01 wt.% of lead (Pb), which COMPLY with the RoHS2 Directive
2015/863/EU. For further information, contact our Sales Department at sales@asb.co.kr.
Authorized Signature, ASB Inc.
This data is based on information provided by our suppliers and we do not validate it by measurement. ASB Inc. assumes no
responsibility in connection with any use of this information. The information is subject to change without notice.
Copyrights ASB Inc., 2019.