1/2 www.asb.co.kr December 2015
The Qualification Report of ASB’s InGaAs E-pHEMT Amplifiers
Reliability & Qualification Report
1. Introduction
This ‘Qualification Report’ is to provide insight to our customers concerning the reliability of ASB’s
high linearity low noise amplifiers, which are manufactured by InGaAs Enhanced-mode pHEMT sem-
iconductor process. Reliability is defined as product performance to specification over time in re-
sponse to varied environmental stress. The ultimate goal of our qualification program is to achieve
continuous improvement in the robustness of the product being evaluated. Finished product reliability
is measured periodically to ensure that the product performance meets or exceeds internal and external
qualification specifications. Qualification programs are executed in response to internal programs as
well as to individual customer requirements. In-house tests are performed and supervised by experi-
enced ASB employees per a qualification system that conforms to the requirements of ISO 9001:2000,
ISO 14001:2004, and JEDEC standards. Several qualification tests are carried out periodically at our
subcontractor site per its standard procedure. ASB has been ISO 9001- and ISO 14001- certified by
Korea International Standards Certification (KIC) since September 2004 and October 2005. The com-
pany strives to provide cost effective and state-of-the-art solutions to its customers in a timely manner
while consistently meeting or exceeding their quality, reliability, and service expectations.
2. An Image of TDFN10 Encapsulated Plastic Package
A plastic encapsulated TDFN10 package is assembled in our subcontractor assembly house at a high-
ly reproducible volume with quality assurance. A very thinned semiconductor die is attached on a
copper lead via thermally and electrically conductive silver epoxy and encapsulated by an epoxy
molding compound (EMC) with a low thermal expansion coefficient.
(Fig. 1) An image of a plastic encapsulated TDFN10 package.
InGaAs Enhanced-mode pHEMT Process