SENSITRON _
SEMICONDUCTOR
DATASHEET 323, REV H
© 2015 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729-4681
Phone (631) 586 7600 Fax (631) 242 9798 www.sensitron.com sales@sensitron.com
SS-100 SCREENING FLOW
SS-100 SCREENING FLOW
DISCRETE SEMICONDUCTORS
(Not applicable for Axial & MELF Diodes)
All parts procured with JAN-S Screening shall be 100% screened in accordance with the following procedure.
SCREEN
NUMBER
TEST / PROCESS
MIL-STD-750 TEST METHOD
TEST CONDITIONS
1a
Die Visual
2073
Condition B
1b
Internal Visual
2074
2069 Power FETs
2072 Transistors
As specified
2
Not Applicable
3a
Temperature Cycling
(Thermal Shock)
1051
No dwell time is required at +25
o
C.
Test condition C, or maximum storage
temperature, whichever is less, 20
cycles. Condition A or B, as specified.
3b
Surge Current
4066
Condition A or B, as specified
3c
Thermal Impedance
3101 Diodes
3103 IGBT
3131 Bipolar
3161 Power FETs
As specified.
4
Constant Acceleration
2006
Y1 @ 10,000g or as specified
5
PIND
2052
Test Condition A
6-7
Not Applicable
-
8
Serialization
-
-
9
Electrical Tests
-
As specified; Read And Record.
10
High Temperature Reverse
Bias
(HTRB)
1038A Diodes and Rectifiers
1039 Transistors
1042 Power FETs
Test Condition A
T
A
= 125C; t = 48 hrs min; V
R
= 80% of
rated V
R
11
Electrical Tests
-
As specified; Read And Record.
12
Burn-In
1038 Diodes and Zeners
1039 Transistors
1042 Power FETs
Test Condition B
Test Condition B
Test Condition A
T
A
= 25C; t = 240 hrs min; Adjust T
A
and Io to maintain the junction
temperature at +125C minimum
13
Electrical Tests
-
As specified; Read And Record.
13a
PDA
5% Max
13b
Other Electrical
-
As specified; Group A, subgroup 3
14
Hermetic Seal
1071
Fine Leak
Gross Leak
15
Radiography
2076
-
16
External Visual
2071
After complete marking, prior to lot
acceptance.
Note: For potted assemblies such as bridge rectifiers, screening is performed on discrete hermetic components prior to assembly
and potting. Completed assemblies are subjected to temperature cycling followed by final electrical parameter verification.
SENSITRON _
SEMICONDUCTOR
DATASHEET 323, REV H
© 2015 Sensitron Semiconductor 221 West Industry Court Deer Park, NY 11729-4681
Phone (631) 586 7600 Fax (631) 242 9798 www.sensitron.com sales@sensitron.com
SS-100 SCREENING FLOW
SS-100 SCREENING FLOW
AXIAL AND MELF ZENER DIODES
All parts procured with JAN-S Screening shall be 100% screened in accordance with the following procedure.
SCREEN
NUMBER
TEST/PROCESS
MIL-STD-750
TEST METHOD
TEST CONDITION
1a
Die Visual
2073
-
1b
Internal Visual
2074
-
3a
Temperature Cycling
(Thermal Shock)
1051
No dwell time is required at +25
o
C. Test condition C, or
maximum storage temperature, whichever is less, 20
cycles.
3b
Surge Current
If specified on Slash Sheet
4066
Condition B as specified
3c
Thermal Impedance
3101
As specified on Slash Sheet
7
Hermetic Seal
1071
-
8
Serialization
-
-
9
Electrical Tests
-
As specified; Read and Record.
10
High Temperature Reverse
Bias (HTRB)
1038A
Test Condition A
T
A
= 150
o
C ; t = 48 hrs; V = 80% of V
Z NOM
11
Electrical Tests and delta
parameters for PDA
-
As specified; Read and Record.
12
Burn-In
1038B
Test Condition B
T
A
= +75
o
C
MAX
. ; t = 240 hrs. ; I
Z (MIN)
≥ as specified ;
T
J
MIN
= as specified; adjust I
Z
and/or T
A
to achieve the
required T
J MIN
13a
Electrical Tests and delta
parameters for PDA
-
As specified; Read and Record ; Group A, subgroup 2
13b
Other Electrical
-
As specified; Group A, subgroup 3
15
Radiography
2076
-
16
External Visual
2071
After complete marking, prior to lot acceptance.