LOCTITE
®
ECCOBOND NCP 5209
Advanced Underfill Solution
LOCTITE
®
ECCOBOND NCP  is a non-conductive paste (NCP) underfill designed to facilitate next-generation fine-pitch
Cu pillar and Cu OSP flip-chip devices. Overcoming the voiding and protection drawbacks of conventional capillary underfills,
LOCTITE
®
ECCOBOND NCP  leverages thermal compression (TC) bonding to offer robust, complete bump protection of
flip-chip devices, with bump pitches less than  µm and gaps less than  µm for a high-reliability result.
Non-conductive paste bonding to semiconductor die
Key Benefits
• Superior joint formation with SOP, NiAu and Cu OSP pad
• Compatible with a variety of substrates and passivations (polyimide and SiN)
��� Design flexibility on chip size and bump configuration
• Ease of processability and workability
• Good dispensing
• Long stage life ( to  min.)
• Excellent reliability performance
• MSL
• , hrs. TCT (-°C to °C)
• , hrs. HTS (°C)
•  hrs. b-HAST (°C / )
•  hrs. work life
All marks used are trademarks and/or registered trademarks of Henkel and its aliates in the U.S., Germany and elsewhere.
© 2014 Henkel Corporation. All rights reserved. 12829/LT-6999 (6/14)
CONVENTIONAL CAPILLARY UNDERFILL (POST APPLIED UNDERFILL) HENKEL THERMAL COMPRESSION NCP (PRE-APPLIED UNDERFILL)
Warpage after mass reflow, leading to “white bump” issue Provide bump protection for fine pitch during bonding process
No bump and solder joint protection before underfill
Designed for Cu OSP, allowing for cost reduction
in high bump count applications
Higher chip warpage after underfill cure Very low warpage and no underfill void
Voiding with low gap height, tight bump pitch and increased NSMD size
No flux residue
Reduced keep out zone (small fillet and no resin bleed-out)
No “white bump” issue
NCP Dispensing
Optimized volume and pattern will give complete coverage
• Volume of NCP used will control fillet formation and
gap filling
• Dispensing equipment for TC-NCP
• Time pressure
• Auger pump
• Room temperature dispense; no heat on substrate
during dispense
• Dispense pattern: Asterisk (die size > 6x6 mm
2
)
NCP Technology
Process Overview
Application Process
NCP Dispense Die Alignment Thermal Compression Bonding Release
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