LOCTITE ECCOBOND UF S

SEMILEVEL UNDERFILL FOR FINEPITCH FLIPCHIP DEVICES

With unyielding consumer demand for higher functioning products in ever-smaller footprints, the electronics

packaging industry is witnessing an accelerated shift from traditional wirebonded devices to flip-chip technology.

Designing a high-performance capillary underfill (CUF) system that provides all the

flip-chip processability benefits required while delivering on the increasingly

demanding performance needs is no small feat. The new LOCTITE ECCOBOND

UFS is the improved version of its well-known LOCTITE ECCOBOND UF. It is

a fast-flow material with a brand new resin system and filler package formulated to

- Passed TCB , cycles (-°C / °C)

- Passed TCB , cycles (-°C / °C)

Homogeneous filler distribution helps mitigate

stress concerns

Wide process window and robust reliability

Passed reliability with and without plasma

Material Properties

Initial Visc. @ . rpm

Initial Visc. @ . rpm

Thixotropic Index (. rpm /  rpm)

 .

LOCTITE ECCOBOND UF S

,

,

.

°C

°C

Units

°C

ppm

ppm

 

 ,

 

 







All marks used above are trademarks and/or registered trademarks of Henkel and its aliates in the U.S., Germany and elsewhere.

©  Henkel Corporation. All rights reserved. /LT /

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