*As per current, June  REACH SVHC documentation.
With miniaturization and increasing component functionality now impacting nearly all electronic sectors,
including automotive and aerospace, improved interconnect protection is critical to achieve highly-demand-
ing reliability requirements. Henkel’s new underfill formulation, LOCTITE
®
ECCOBOND
®
UF , safeguards
fine-pitch array devices such as BGAs and CSPs in a formulation that can withstand the high operating
temperatures induced by smaller, higher-functioning devices within harsh environments. With a T
g
of °C,
a low CTE and no reportable REACH SVHCs* or CMR classifications, LOCTITE ECCOBOND UF  oers stress-
reducing interconnect protection at high operating temperatures, while prioritizing health and safety.
LOCTITE
®
ECCOBOND
®
UF 
HIGH RELIABILITY, NONREWORKABLE EPOXY UNDERFILL
*As per current, June 2018 REACH SVHC documentation.
All marks used are trademarks and/or registered trademarks of Henkel and its aliates in the U.S., Germany and elsewhere.
©  Henkel Corporation. All rights reserved. LT /
Across the Board,
Around the Globe.
henkel-adhesives.com/electronics
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Irvine, CA  B, Westerlo WaiGaoQiao FTZ
US Belgium Shanghai  China
... .. ...
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity by Rheometer AR  at  s
-
(Pa-s) .
Thixotropic Index .
Pot Life at °C (hours) 
Shelf Life at -°C (days) 
Filler Loading 
TYPICAL PROPERTIES OF CURED MATERIAL
Glass Transition
Temperature, T
g
by TMA (°C)

Coefficient of
Thermal Expansion
(ppm/°C)
Below T
g
: 
Above T
g
: 
Storage Modulus, °C (MPa) ,
LOCTITE ECCOBOND UF  is designed to provide a uniform and void-free encapsulant underfill, maximizing the
device's temperature cycling capability and distributing stress away from solder connects thus enhancing solder
joint reliability in CSP and BGA packages.
Key Benefits
• Solder connection protection from shock, drop,
vibration and moisture
• Able to withstand high operating temperatures
with a high T
g
of °C and low CTE
• Excellent thermal cycling performance (passed
, cycles of thermal shock of -°C/°C)
• One-component material, no mixing required
• Can be jet or needle dispensed
• Fast flowing, quick curing
• Does not contain any reportable REACH SVHCs*
and is not MR classified
• Long shelf life