Features
Very compact 500 µm pitch package, for
easy PCB layout
Ultra-large bandwidth: 18 GHz
Ultra-low capacitance: 0.15 pF (I/O to I/O)
and 0.25 pF (I/O to GND)
Low leakage current: < 1 nA
Extended operating junction temperature
range: -40 °C to 150 °C
Thin package: 0.4 mm max.
RoHS compliant
Benefits
High ESD protection level
High integration
Suitable for high density boards
Complies with the following standards
MIL-STD 883G method 3015-7 class 3B > 8
kV
Exceeds IEC61000-4-2 level 4
±10 kV (contact discharge)
±25 kV (air discharge)
Applications
The HSP053-4M5 is designed to protect against
to electro-static discharge sub-micron technology
circuits driving:
HDMI 1.4 and HDMI 2.0
USB 3.1 Gen 1 and Gen 2
Digital video interface
Display port
Serial ATA
The ultra-low variation of the capacitance
ensures very low influence on signal-skew. The
large bandwidth makes it compatible with HDMI
2.0 (= 5.94 Gbps) and USB 3.1 Gen 2
(= 10 Gbps).
Description
The HSP053-4M5 is a 4 channel ESD array with
a rail to rail architecture designed specifically for
the protection of high speed differential lines.
The device is packaged in
μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
Figure 1: Functional diagram