1-3 Reliability testing procedures
Reliability
parameter
Test Test methods and remarks Test requirement
Pulse current
capability
Imax
8/20 ㎲
IEC 1051-1, Test 4.5.
10 pulses in the same direction at 2
pulses per minute at maximum peak
current
dVn/Vn≤10%
no visible damage
Electrostatic
discharge
capability
ESD
C=150 pF,
R=330Ω
IEC 1000-4-2
Each 10 times in positive/negative
direction in 10 sec at 8KV contact
discharge (Level 4)
dVn/Vn≤10%
no visible damage
Environmenta
l reliability
Thermal shock
IEC 68-2-14
Condition for 1 cycle
Step 1 : Min. –40℃, 30±3 min.
Step 2 : Max. +125℃, 30±3 min.
Number of cycles: 30 times
dVn/Vn≤5%
no visible damage
Low temperature
IEC 68-2-1
Place the chip at -40±5℃ for 1000±
12hrs. Remove and place for 24±2hrs at
room temp. condition, then measure
dVn/Vn≤5%
no visible damage
High temperature
IEC 68-2-2
Place the chip at 125±5℃ for 1000±
24hrs. Remove and place for 24±2hrs at
room temp. condition, then measure
dVn/Vn≤5%
no visible damage
Heat resistance
IEC 68-2-3
Apply the rated voltage for 1000±48hrs
at 85±3℃. Remove and place for 24±
2hrs at room temp. condition, then
measure
dVn/Vn≤5%
no visible damage
Humidity
resistance
IEC 68-2-30
Place the chip at 40±2℃ and 90 to 95%
humidity for 1000±24hrs. Remove and
place for 24±2hrs at room temp.
condition, then measure
dVn/Vn≤10%
no visible damage
Pressure cooker
test
Place the chip at 2 atm, 120℃, 85%RH
for 60 hrs. Remove and place for 24±
2hrs at room temp. condition, then
measure
dVn/Vn≤10%
no visible damage
Operating life
Apply the rated voltage for 1000±48hrs
at 125±3℃. Remove and place for 24±
2hrs at room temp. condition, then
measure
dVn/Vn≤10%
no visible damage
Rev : www.leiditech.com
01.06.2017
2/5
PESD0521U080