PACKAGE INFORMATION
PE-WLCSP-8-P2-190524
• WLCSP-8-P2 Unit: mm
PACKAGE DIMENSIONS
TAPING SPECIFICATION
TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc)
1 reel = 5,000 pcs
Dummy Pocket
0.2±0.05
1.5
+0.
1
0
4.0±0.1
2.0±0.05
2.0±0.05
0.5±0.05
4.0±0.1
1.07
1.66
3.5±0.05
1.75±0.1
8.0±0.3
0.48±0.05
E2
User Direction of Feed
∅
PACKAGE INFORMATION
PE-WLCSP-8-P2-190524
POWER DISSIPATION (WLCSP-8-P2)
The following measurement conditions are based on JEDEC STD. 51-9.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
101.5 mm x 114.5 mm x 1.6 mm
Copper Ratio
Outer Layers (First and Fourth Layers): 60%
Inner Layers (Second and Third Layers): 100%
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
JEDEC STD. 51-9 Test Land Pattern
Power Dissipation 800 mW
Thermal Resistance
ja = (125 − 25°C) / 0.8W = 125 °C/W
ja: Junction-to-Ambient Thermal Resistance
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
IC Mount Area (mm)
Measurement Board Pattern
Power Dissipation P
D
(mW)
1200
1000
800
600
400
200
0
0 25 50 75 85 100 125 150
JEDEC STD. 51-9
Test Land Pattern
1
14.5
101.5
The power dissipation of the
package is dependent on PCB material, layout, and environmental conditions.