Rev.1.0, 20
1
Descri
p
WMOS
TM
j
unction
M
balance t
e
and low g
a
suitable f
o
power den
Feature
V
DS
=
7
Typ.
R
100%
Pb-fre
Applica
LED Light
n
Absolut
e
Drain-sour
c
Continuous
Pulsed drai
Gate-sourc
Avalanche
e
Avalanche
e
Avalanche
c
Power diss
i
Operating
a
Continuous
Diode puls
e
Thermal
C
Thermal re
s
Thermal re
s
1
5
p
tion
C2 is W
a
M
OSFET f
a
e
chnology f
o
a
te charge
or
applica
t
sity and ou
s
7
00V @ T
j
,
m
R
DS(on)
=1.0
UIS tested
e plating,
H
tions
ing, Charg
e
Maximu
m
Parame
t
c
e voltage
drain current
n current
2)
e
voltage
e
nergy, singl
e
e
nergy, repeti
c
urrent, repet
i
i
pation ( T
C
=
2
- De
r
a
nd storage t
e
diode forwar
d
e
current
C
haracte
r
Parame
t
s
istance, junc
t
s
istance, junc
t
a
yon’s 2
nd
a
mily that
o
r extremel
y
performan
c
t
ions whic
h
tstanding e
m
ax
H
alogen fre
e
e
r
,
A
dapte
r
m
Ratings
t
e
r
1)
( T
C
= 2
5
( T
C
= 10
0
e
pulse
3)
tive
2)
i
tive
2)
2
5°C )
r
ate above 25
e
mperature ra
n
d
current
r
istics
t
e
r
t
ion-to-case
t
ion-to-ambie
n
65
0
generatio
n
is utilizing
y
low on-r
e
c
e. WMOS
h
require
fficiency.
e
r
, PC, LCD
Sym
V
D
S
5
°C )
0
°C )
I
D
I
D
M
V
G
E
A
E
A
I
A
R
°C
P
D
n
ge T
j
,
T
I
S
I
S,
pu
Sym
R
θ
J
n
t R
θ
J
Doc.W08
6
WML
0
WMO
0
0
V 1.0
n
super
charge
e
sistance
TM
C2 is
superior
TV, Server
bol WMH
/
S
S
D
M
G
S
A
S
R
R
D
T
st
g
S
u
lse
bol WMH
/
J
C
J
A
6
5002
0
7N65C2,
0
7N65C2,
Super
J
/
WMM/WMO/
W
42
0.34
-5
5
/
WMM/WMO/
W
3
62
TO-2
2
TO-2
5
R
c
o
WMH07N
WMP07N
J
unctio
n
W
MP/WMG
650
5
3
9
±30
15
0.1
0.7
5
to +150
5
9
W
MP/WMG
2
0F T
O
5
2 TO-
R
oHS
o
mpliant
65C2, W
M
65C2, W
M
n
Power
WML
23
0.18
WML
5.4
80
O
-263
251S3
T
1 / 10
M
M07N65
C
M
G07N65
C
MOSF
E
Unit
V
A
A
A
V
mJ
mJ
A
W
W/°C
°C
A
A
Unit
°C/W
°C/W
TO-251
T
O-251S2
C
2
C
2
ET
Rev.1.0, 2015 www.way-on.com 2 / 10
WMx07N65C2
Electrical Characteristics T
c
= 25°C, unless otherwise noted
Parameter Symbol Test Condition Min. Typ. Max. Unit
Static characteristics
Drain-source breakdown voltage BV
DSS
V
GS
=0 V, I
D
=0.25 mA 650 - - V
Gate threshold voltage V
GS
(
th
)
V
DS
=V
GS
, I
D
=0.25mA 2.5 3.3 4.5 V
Drain cut-off current I
DSS
V
DS
=650 V, V
GS
=0 V,
T
j
= 25°C
T
j
= 125°C
-
-
-
10
1
-
μA
Gate leakage current, forward I
GSSF
V
GS
=30 V, V
DS
=0 V - - 100 nA
Gate leakage current, reverse I
GSSR
V
GS
=-30 V, V
DS
=0 V - - -100 nA
Drain-source on-state resistance R
DS(on)
V
GS
=10 V, I
D
=2A
T
j
= 25°C
-
-
1.0
1.14
Dynamic characteristics
Input capacitance C
iss
V
DS
= 25 V, V
GS
= 0 V,
f = 1 MHz
- 270 -
pF
Output capacitance C
oss
- 200 -
Reverse transfer capacitance C
rss
- 2 -
Turn-on delay time t
d
(
on
)
V
DD
= 300V, I
D
= 2A
R
G
= 25, V
GS
=10V
- 5 -
ns
Rise time t
r
- 16 -
Turn-off delay time t
d
(
off
)
- 24 -
Fall time t
f
- 12 -
Gate charge characteristics
Gate to source charge Q
g
s
V
DD
=480 V, I
D
=2A,
V
GS
=0 to 10 V
- 1.6 -
nC
Gate to drain charge Q
g
d
- 1.7 -
Gate charge total Q
g
- 5.8 -
Gate plateau voltage V
p
lateau
- 5 - V
Reverse diode characteristics
Diode forward voltage V
SD
V
GS
=0 V, I
F
=2A - - 1.2 V
Reverse recovery time t
r
r
V
R
=50 V, I
F
=2A,
dI
F
/dt=100 A/μs
- 163 - ns
Reverse recovery charge Q
r
r
- 0.84 - μC
Peak reverse recovery current I
rrm
- 10.3 - A
Notes:
1. Limited by T
j max
. Maximum duty cycle D=0.5.
2. Repetitive rating: pulse width limited by maximum junction temperature
3. I
AS
= 0.7A, V
DD
= 50V, R
G
= 25, starting T
j
= 25°C