SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
6
SERIES BEC
BOARD EDGE CONNECTOR 230 PINS (SMT)
SPECIFICATIONS
Insulation Resistance: 250M at 500V DC
Withstanding Voltage: 500V AC for 1 minute
Contact Resistance: 40m max.
Current Rating: 0.5A
Voltage Rating: 50V DC
Operating Temp. Range: –40°C to +85°C
Mating Cycles: 30 times
MATERIALS AND FINISH
Insulator: LCP
Contacts: Phosphor Bronze
Contact Plating: Mating Area - Au Flash over Ni
- 15µ“ Au over Ni
- 30µ“ Au over Ni
Solder Area - Au Flash over Ni
SMT Tabs: Brass
SMT Plating: Ni, Solder Tails Tin
FEATURES
• Contacts designed to follow and balance the PCB
regardless of the thickness (within tolerance)
• Fixation designed to offer mechanical stability
• Improved EMI connection with additional ground connection
• PCB chamfer on mating area could be omitted
• Mating area compatible with Qseven and MXM 1.0 standard cards
• RoHS2011/65/EU
BEC - 0.5 - 230 - S9 - *F - R - EDC
RECOMENDED PCB LAYOUT
OUTLINE DIMENSIONS
PART NUMBER
Series
Pitch: 0.50mm
Pin Count: 230
Orientation: 90°
Contact Area Plating*
FF = Au Flash
BF = 15µ“ Au
AF = 30µ“ Au
Tape and Reel (300pcs. per reel)
Design No. (internal)
AUTOMOTIVE
COMPLIANT