fast Rise™ 7 Prepreg
Preliminary Data Sheet
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Benets & Applications:
• High 7.45 DK organic prepreg
• Low (420 ºF/215 ºC) lamination
enables conventional PWB
fabrication
• Lower cost/reduced weight
alternative to LTCC
• Lower cost alternative to
fusion bonding
• Enables miniaturization &
densication of high DK RF
stripline structures
• Compatible with Ticer/
Ohmega resistor foils
• Military and Avionics (weight
reduction)
• Radar Manifolds, Antennas,
Fire Control
• Filters, Couplers, Power Ampliers
• Phase Matching Networks
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
fastRise™7
is a thermally stable, high DK
(7.45 at 10 GHz), low loss prepreg
designed to enable the manufacture of high dielectric constant stripline
structures at low temperatures. fastRise™ 7 prepreg enables stripline
manufacture at 420 ºF/215 ºC, well below the fabrication temperatures
of Low Temperature Co-red Ceramics (LTCC).
Organic high dielectric constant copper clad laminates such as RF-
60A have previously had no available prepregs with compatible high
dielectric constant. erefore RF stripline designers have been forced
to use either LTCC or the fusion bonding of PTFE-based organic
substrates.
RF engineers design high dielectric constant stripline structures to: (1)
densify/miniaturize circuits (2) eliminate cross talk between multiple
channels (3) create more conned elds (4) create more symmetrical
EM elds with better control over even/odd mode impedances (5)
reduce radiation (6) allow for broadband multi-octave couplers and
lters (7) design phase matching networks. Miniaturization is especially
important for weight reduction in avionic applications.
For organic structures, RF designers oen resort to fusion bonding
to create symmetrical dielectrics above and below the signal layer.
Fusion bonding is the melting of PTFE at very high temperatures.
Fusion bonding is expensive and prone to unpredictable dimensional
movement and poor layer to layer registration and there are few capable
fabricators*. fastRise™ 7 is a low cost solution that enables epoxy
fabricators to build moisture resistant RF stripline structures.
When combined with Ticer or Ohmega resistor foil, fastRise™ 7 leads to
a lower likelihood of resistor cracking, a typical defect in fusion bonded
structures.
* For more information, please visit www.taconic-add.com and view
Technical Topic: Strategies for Designing Microwave Multilayer
Printed Circuit Boards Using Stripline Structures.
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
All reported values are typical and should not be used for specication purposes. In all instances, the user shall determine suitability in any
given application.
fastRise™ 7 Typical Values
Property Test Method Unit Value Unit Value
Pressed ickness
Between Ground Planes
mils 5.5 mils 5.5
Dk @ 10 GHz IPC 2.5.5.5.1 (modied) 7.45 7.45
Df @ 10 GHz IPC 2.5.5.5.1 (modied) 0.0030 0.0030
Moisture Absorption IPC-650 2.6.2.1 % 0.1 % 0.1
Dielectric Breakdown ASTM D 149/IPC-650 2.5.6 kV 40.0 kV 40.0
Volume Resistivity IPC-650 2.5.17.1 (aer temp./humidity) Mohms/cm 5.93 x 10
5
Mohms/cm 5.93 x 10
5
Surface Resistivity IPC-650 2.5.17.1 (aer temp./humidity) Mohms 4.97 x 10
5
Mohms 4.97 x 10
5
Flex Strength (MD) ASTM D 790 (02) psi 14,500 N/mm
2
99.97
Flex Strength (CD) ASTM D 790 (02) psi 7,650 N/mm
2
52.74
ermal Conductivity ASTM F 433 W/m-K .43 W/m-K .43
T
c
K (-30 to 110° C) IPC-650 2.5.5.5.1 (modied) ppm/°C -326 ppm/°C -326
Dimensional Stability (MD) IPC-650 2.4.39 (Aer Bake) mil/in. -0.5 mm/M -0.5
Dimensional Stability (CD) IPC-650 2.4.39 (Aer Bake) mil/in. -0.6 mm/M -0.6
Dimensional Stability (MD) IPC-650 2.4.39 (ermal Stress) mil/in. -1.0 mm/M -1.0
Dimensional Stability (CD) IPC-650 2.4.39 (ermal Stress) mil/in. -1.4 mm/M -1.4
CTE (X axis) (25 -125° C) IPC-650 2.4.41/TMA ppm/°C 10 ppm/°C 10
CTE (Y axis) (25 -125° C) IPC-650 2.4.41/TMA ppm/°C 17 ppm/°C 17
CTE (Z axis) (25 -125° C) IPC-650 2.4.41/TMA ppm/°C 62 ppm/°C 62
Density (Specic Gravity) ASTM D 792 g/cm
3
2.24 g/cm
3
2.24
Resin Flow IPC-650 2.3.17 % 4.9 % 4.9
Notes for fabricating with fastRise™ 7: These grades of fastRise™ are lower owing grades of the fastRise™ prepreg series and care must be taken
during lamination to avoid lamination voids caused by low pressure areas. fastRise™ is shipped at a very low degree of cure. The best
ow conditions are achieved when the prepreg spends the maximum amount of time possible at a temperature of 250°F (121°C) using
the highest possible pressure. For difcult ow and ll designs, lamination should begin at 250°F (121°C) and held for 30-60 minutes at
maximum pressure, followed by a slow 2.0-4.0°C/min ramp rate to 216°C (420°F). These prepregs are not recommended for blind and
buried via ll. Because of the large number of possible applications for the fastRise™ prepreg series and the complexity of many multilayer
printed circuit designs, Taconic does not warranty or guarantee the performance of fastRise™ when combined with any supplier’s core
materials. It is the responsibility of the end user to determine the suitability of fastRise™ with various core materials for each application.
rev. 7/15
Microsection of 6 copper layer multilayer
containing RF-60A-0100 and fastRise™ 7
prepreg (PWBs courtesy of Delta Circuits,
Faireld, NJ)