HSMP-386x
Surface Mount PIN Diodes
Data Sheet
Features
• Unique Congurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Distortion Switching
– Low Capacitance
• Attenuating
–
Low Current Attenuating for Less Power
Consumption
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power
Dissipation
• Low Failure in Time (FIT) Rate
[1]
• Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Description/Applications
The HSMP-386x series of general purpose PIN diodes are
designed for two classes of applications. The rst is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total Capacitance (C
T
) and Total
Resistance (R
T
) are typical specications. For applications
that require guaranteed performance, the general purpose
HSMP-383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Pin Connections and Package Marking, SOT-363
Notes:
1. Package marking provides orientation, identication, and date code.
2. See “Electrical Specications” for appropriate package marking.
LUx
1
2
3
6
5
4
2
Package Lead Code Identication,
SOT-23, SOT-143
(Top View)
Package Lead Code Identication,
SOT-323
(Top View)
COMMON
CATHODE
#4
COMMON
ANODE
#3
SERIES
#2
SINGLE
#0
COMMON
CATHODE
F
COMMON
ANODE
E
SERIES
C
SINGLE
B
Package Lead Code Identication,
SOT-363
(Top View)
UNCONNECTED
TRIO
L
123
654
Electrical Specications T
C
= 25°C, each diode
PIN General Purpose Diodes, Typical Specications T
A
= 25°C
Package Minimum Typical Typical
Part Number Marking Lead Breakdown Series Resistance Total Capacitance
HSMP- Code Code Conguration Voltage V
BR
(V) R
S
(Ω) C
T
(pF)
3860 L0 0 Single 50 3.0/1.5* 0.20
3862 L2 2 Series
3863 L3 3 Common Anode
3864 L4 4 Common Cathode
386B L0 B Single
386C L2 C Series
386E L3 E Common Anode
386F L4 F Common Cathode
386L LL L Unconnected Trio
Test Conditions V
R
= V
BR
I
F
= 10 mA V
R
= 50 V
Measure f = 100 MHz f = 1 MHz
I
R
≤ 10 µA I
F
= 100 mA*
Absolute Maximum Ratings
[1]
T
C
= +25°C
Symbol Parameter Unit SOT-23 SOT-323
I
f
Forward Current (1 µs Pulse) Amp 1 1
P
IV
Peak Inverse Voltage V 50 50
T
j
Junction Temperature °C 150 150
T
stg
Storage Temperature °C -65 to 150 -65 to 150
q
jc
Thermal Resistance
[2]
°C/W 500 150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
C
= +25°C, where T
C
is dened to be the temperature at the package pins where contact is made to
the circuit board.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid
Static Discharge.
RING
QUAD
D
1
3
2
4
See separate data sheet HSMP-386D