n Fast acting precision thin ﬁlm chip fuse for

overcurrent protection

n 1005 (EIA 0402) miniature footprint

n Surface mount packaging for automated

assembly

n UL listed (UL 248-14)

n RoHS compliant* and halogen free**

Electrical Characteristics

SF-0402FP Series - Fast Acting Precision Surface Mount Fuses

Model

Rated Current

(Amps)

Fusing Time

Resistance

(mΩ)***

Rated

Voltage

Breaking

Capacity

Typical

t (A

s)****

SF-0402FP050 0.50

Open within 5 sec.

at 200 % rated

current

380

DC 32 V DC32 V 35 A

0.00317

SF-0402FP080 0.80 120 0.00532

SF-0402FP100 1.00 95 0.00724

SF-0402FP125 1.25 67 0.01344

SF-0402FP150 1.50 51 0.01356

SF-0402FP160 1.60 46 0.01672

SF-0402FP200 2.00 33 0.01983

SF-0402FP250 2.50 22.5 0.03763

SF-0402FP300 3.00 20 0.05427

SF-0402FP315 3.15 19 0.06304

SF-0402FP400 4.00 16 0.0896

Reliability Testing

SinglFuse

™

SF-0402FP Series Features

*** Resistance value measured with less than 10 % of rated current. Tolerance ±25 %.

****Typical I

t value measured at 10x rated current.

No. Test Requirement Test Condition

1 Carrying Capacity No fusing Rated current, 4 hours

2 Fusing Time Within 5 seconds 200 % of its rated current

3 Interrupting Ability No mechanical damages

After the fuse is interrupted, rated voltage applied

for 30 seconds again

4 Bending Test No mechanical damages

Distance between holding points: 90 mm,

Bending: 3 mm,1 time, 30 seconds

5 Resistance to Solder Heat ±20 % 260 °C ±5 °C,10 seconds ±1 second

6 Solderability 95 % coverage minimum

235 °C ±5 °C, 2 ±0.5 second

245 °C ±5 °C, 2 ±0.5 second (lead free)

7 Temperature Rise <75 ° C

100 % of its rated current, measure of surface

temperature

8 Resistance to Dry Heat ±20 % 105 °C ±5 °C,1000 hours

9 Resistance to Solvent

No evident damage on protective coating

and marking

23 °C ±5 °C of isopropyl alcohol, 90 seconds

10 Residual Resistance 10k ohms or more Measure DC resistance after fusing

11 Thermal Shock DR < 10 % -20 °C / +25 °C /+125 °C /+25 °C, 10 cycles

Operating Temperature .......................................-20 °C to +105 °C

Storage Conditions

Temperature .....................................................+5 °C to +35 °C

Humidity................................................................40 % to 75 %

Shelf Life................................ 2 years from manufacturing date

Moisture Sensitivity Level ............................................................. 1

ESD Classication (HBM)...................................................Class 6

Environmental Characteristics

WARNING Cancer and Reproductive Harm

www.P65Warnings.ca.gov

* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU

June 8, 2011.

** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or

less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and

Chlorine (Cl) content is 1500 ppm or less.

“SinglFuse” is a trademark of Bourns, Inc.

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth

on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

UL File Number ............................................................... E198545

Agency Recognition

n Portable memory

n LCD monitors

n Disk drives

n PDAs

n Digital cameras

n DVDs

n Cell phones

n Rechargeable battery packs

n Battery chargers

n Set top boxes

n Industrial controllers

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

SF-0402FP Series - Fast Acting Precision Surface Mount Fuses

Solder Reow Recommendations

Peak: 250 +0/-5 °C

230 °C or higher

PRE-HEATING ZONE

SOLDERING ZONE

HEATING TIME

180 °C

PEAK: 250 +0/-5 °C, 5 seconds

PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds

SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds

250

200

150

TEMPERATURE (°C)

100

150 °C

90 ± 30 Seconds

30 ± 10 Seconds

Peak: 250 +0/-5 °C

230 °C or higher

PRE-HEATING ZONE

SOLDERING ZONE

HEATING TIME

180 °C

PEAK: 250 +0/-5 °C, 5 seconds

PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds

SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds

250

200

150

TEMPERATURE (°C)

100

150 °C

90 ± 30 Seconds

30 ± 10 Seconds

Product Dimensions Recommended Pad Layout

1.0 ± 0.1

(.039 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.35 ± 0.05

(.014 ± .002)

0.52 ± 0.05

(.020 ± .002)

1.50 ± 0.1

(.059 ± .004)

0.55 ± 0.05

(.022 ± .002)

0.50 ± 0.1

(.020 ± .004)

1.0 ± 0.1

(.039 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.35 ± 0.05

(.014 ± .002)

0.52 �� 0.05

(.020 ± .002)

1.50 ± 0.1

(.059 ± .004)

0.55 ± 0.05

(.022 ± .002)

0.50 ± 0.1

(.020 ± .004)

DIMENSIONS:

(INCHES)

Thermal Derating Curve

120

110

100

-20 02040

AMBIENT TEMPERATURE (°C)

PERCENT OF RATING (%)

60 80 100 120

Construction & Material Content

OVERCOAT

Sn PLATING

CERAMIC SUBSTRATE

FUSE ELEMENT

Cu / Ni PLATING

1.0 ± 0.1

(.039 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.35 ± 0.05

(.014 ± .002)

0.52 ± 0.05

(.020 ± .002)

1.50 ± 0.1

(.059 ± .004)

0.55 ± 0.05

(.022 ± .002)

0.50 ± 0.1

(.020 ± .004)

SinglFuse

™

SF-0402FP Series Applications

10,000 pieces per 7-inch reel

Packaging Quantity