MCM6926A
1
MOTOROLA FAST SRAM
Advance Information
128K x 8 Bit Fast Static Random
Access Memory
The MCM6926A is a 1,048,576 bit static random access memory organized
as 131,072 words of 8 bits. Static design eliminates the need for external clocks
or timing strobes.
Output enable (G
) is a special control feature that provides increased system
flexibility and eliminates bus contention problems.
This device meets JEDEC standards for functionality and revolutionary pinout,
and is available in a 400 mil plastic small–outline J–leaded package.
Single 3.3 V Power Supply
Fully Static No Clock or Timing Strobes Necessary
All Inputs and Outputs Are TTL Compatible
Three State Outputs
Fast Access Times: 8, 10, 12, 15 ns
Center Power and I/O Pins for Reduced Noise
Fully 3.3 V BiCMOS
BLOCK DIAGRAM
ROW
DECODER
MEMORY
MATRIX
512 ROWS x 256 x 8
COLUMNS
INPUT
DATA
CONTROL
COLUMN I/O
COLUMN DECODER
A
A
A
A
A
A
A
A
DQ
AA A A
E
W
V
DD
V
SS
A
A A A A
DQ
G
This document contains information on a new product. Motorola reserves the right to change or discontinue this product without notice.
Order this document
by MCM6926A/D
SEMICONDUCTOR TECHNICAL DATA
PIN ASSIGNMENT
MCM6926A
WJ PACKAGE
400 MIL SOJ
CASE 857A–02
32
31
30
29
28
27
26
25
24
23
22
21
2
3
1
5
6
4
7
9
10
8
12
13
11
14
20
15
16
19
18
17
A
A
A
E
A
W
A
A
A
V
DD
A
A
A
A
DQ
DQ
A
G
A
A
V
SS
DQ
DQ
AA
A
DQ
DQ
DQ
DQ
A Address Input. . . . . . . . . . . . . . . . . . . . . . .
E
Chip Enable. . . . . . . . . . . . . . . . . . . . . . . .
W
Write Enable. . . . . . . . . . . . . . . . . . . . . . .
G
Output Enable. . . . . . . . . . . . . . . . . . . . . .
DQ Data Input/Output. . . . . . . . . . . . . . . . . .
V
DD
+ 3.3 V Power Supply. . . . . . . . . . . . .
V
SS
Ground. . . . . . . . . . . . . . . . . . . . . . . . . .
PIN NAMES
V
SS
V
DD
REV 2
8/14/98
Motorola, Inc. 1998
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...
MCM6926A
2
MOTOROLA FAST SRAM
TRUTH TABLE (X = Don’t Care)
E G W Mode V
DD
Current Output Cycle
H X X Not Selected I
SB1
, I
SB2
High–Z
L H H Output Disabled I
DDA
High–Z
L L H Read I
DDA
D
out
Read Cycle
L X L Write I
DDA
High–Z Write Cycle
ABSOLUTE MAXIMUM RATINGS (See Note)
Rating
Symbol Value Unit
Power Supply Voltage V
DD
– 0.5 to + 4.6 V
Voltage Relative to V
SS
for Any Pin
Except V
DD
V
in
, V
out
– 0.5 to V
DD
+ 0.5 V
Output Current I
out
± 30 mA
Power Dissipation P
D
0.6 W
Temperature Under Bias T
bias
– 10 to + 85 °C
Operating Temperature T
A
0 to + 70 °C
Storage Temperature — Plastic T
stg
– 55 to + 125 °C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could af fect device reliability.
DC OPERATING CONDITIONS AND CHARACTERISTICS
(V
DD
= 3.3 V + 10%, – 5%, T
A
= 0 to 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Typ Max Unit
Supply V oltage (Operating Voltage Range) V
DD
3.135 3.3 3.6 V
Input High Voltage V
IH
2.2
V
DD
+ 0.3**
V
Input Low Voltage V
IL
– 0.5*
0.8 V
*V
IL
(min) = – 0.5 V dc; V
IL
(min) = – 2.0 V ac (pulse width 2.0 ns) for I 20.0 mA.
**V
IH
(max) = V
DD
+ 0.3 V dc; V
IH
(max) = V
DD
+ 2 V ac (pulse width 2.0 ns) for I 20.0 mA.
DC CHARACTERISTICS
Parameter Symbol Min Max Unit
Input Leakage Current (All Inputs, V
in
= 0 to V
DD
) I
lkg(I)
± 1.0 µA
Output Leakage Current (E = V
IH
, V
out
= 0 to V
DD
) I
lkg(O)
± 1.0 µA
Output Low Voltage (I
OL
= + 8.0 mA) V
OL
0.4 V
Output High Voltage (I
OH
= – 4.0 mA) V
OH
2.4 V
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to these high–impedance
circuits.
This BiCMOS memory circuit has been de-
signed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established. The circuit is in a test
socket or mounted on a printed circuit board
and transverse air flow of at least 500 linear feet
per minute is maintained.
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...