Benets & Applications:
• FR4 lamination temperatures
• Low DK enables reduced PWB
thickness for the same impedance
• ermosetting prepreg will not
reow
• Fiberglass-free prepreg
• Compatible with conventional
lamination processes
• Can be combined with any core
material
• Laser Ablatable
• Flame retardant UL V-0 bondplys
& coverlays
• High Speed Flex Cables
• in Multilayers
• ATE testing
• mmWave Antenna/Automotive
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
fastRise™EZ
is a low temperature curing, low
loss exible prepreg/bondply/
coverlay series of products. FR-EZ is designed to enable the manufacture
of complex rigid/ex PWBs containing polyimide (DuPont™ Pyralux®
AP/TK exible circuit materials), LCP or PTFE cores without excessive
movement. fastRise™ EZ is exible when thin and can be combined with
various exible or rigid copper clad core materials. FR-EZ is based on a
thermosetting adhesive and PTFE lm. FR-EZ has low moisture absorp-
tion and is capable at high frequencies due to its low dissipation value.
fastRise™ EZ bonds well to Taconic’s PTFE cores and to otherwise dicult
substrates such as Pyralux® AP polyimide, PEEK, LCP, at planes of PTFE
or hydrocarbon (synthetic rubber). Taconic’s PTFE-rich TLY 5 and other
non reinforced PTFE-rich substrates can be well bonded with FR-EZ.
Flame retardant FR-EZ27f bondply and FR-EZ CLHH and FR-EZ CL2H
coverlays were designed for commercial applications requiring UL V-0.
fastRise™ EZ’s low loss enables the design of exible high speed cables and
rigid RF/digital multilayers without the uncertainties and costs associated
with the high temperature lamination of PTFE or LCP materials. FR-EZ
can also be used to replace cable harnesses with denser ex circuits. e low
moisture absorption of 0.2% is very attractive vs conventional polyimides.
FR-EZ can be sequentially laminated, has better bonding capabilities
with copper than other RF prepregs and will yield higher peel strengths
in a foil lamination. e low DK of FR-EZ is advantageous in ex
applications to reduce thickness while maintaining the same impedance.
e low modulus of FR-EZ allows for more ductility in a thicker multilayer.
e low dissipation values of FR-EZ is an option for any multilayer stack-
up where pure packages of other materials have fabrication challenges.
Taconic is a world leader in RF laminates and high speed digital
materials, oering a wide range of high frequency laminates and pre-
pregs. ese advanced materials are used in the fabrication of antennas,
multilayer RF and high speed digital boards, interconnections and devices.
fastRise™ EZ Bondplys & Coverlays
Flame Retardant Bondplys and Coverlays
FR-EZ27f bondply and FR-EZ coverlays use conventional technology to achieve UL VO ame retardance.
Taconic has been able to achieve extremely low electrical loss with these ame retardant materials. e ame re-
tardant versions of FR-EZ and respective coverlays show greater exibility than the non-ame retardant versions.
Additionally, the ame retardant bondply and coverlays retain high thermal stability and do not outgas until
temperatures of 400+°C / 752°F are reached.
fastRise™ EZ for Traditional Rigid-Flex Builds
fastRise™ EZ is well suited for higher layer count ex and rigid-ex builds as a replacement for bond-
ing sheets utilizing acrylic adhesives. Acrylic adhesives in exible circuitry are a known source of process-
ing challenges that can lead to reliability concerns. Most of these diculties are encountered in the pro-
cesses from via formation through via metallization, as the acrylic is very sensitive to drill parameters,
plasma parameters and some chemistries. fastRise™ EZ eliminates these concerns by using a exible thermo-
set resin system and additionally eliminates the need for a “bikini” approach to rigid-ex stripline structures.
What Does is Mean for the Fabricator?
Multilayer Flex
��� Increased yields from microsection evaluation
• Greater via reliability
Rigid-Flex
• Eliminate the need to pre-rout bond-ply before lamination
• Eliminate the need for no-ow prepreg and routing of that prepreg within a multilayer ex
structure in a rigid-ex
• Eliminate expensive custom tooling for lamination
fastRise™ EZ Prepregs
-0.4
-0.3
-0.2
-0.1
0.0
0 2 4 6 8 10
Change in Loss (dB/inch)
Frequency (GHz)
Change in Loss Due To Water Immersion
Change in insertion loss with moisture uptake aer water immersion for various stripline test vehicles (Pyralux®
TK/TK, Pyralux® AP/LF, Pyralux® TK/FREZ and Pyralux® AP/FREZ).
Pyralux® is a registered trademark of E. I. du Pont de Nemours and Company
TK-TK
TK-FREZp
TK-FREZp
AP-FREZp
AP-FREZp
AP-LF
FR-EZ / Pyralux® AP
FR-EZ / Pyralux® TK