
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
Benets & Applications:
• Extremely low skew
• Nanotechnology based PTFE
laminate
• Drill quality of FR4 (1000+
hits/bit)
• Registration of FR4
• Extremely low berglass
content (~10%)
• <0.18% dielectric constant
variation within a lot
• Standard with at ED or rolled
copper
• Temperature stable DK
• Capable of 40+ layer large
format PWBs
• CAF resistant
• Semiconductor testing at 25
gbps and higher
• Test and measurement
• Optical data transport and
backplane routers
• Hybrid FR4 PWBs combining
microwave and digital signals
• Space and defense
EZ-IO-F
is a thermally stable composite based on
nanotechnology, spread weave, and PTFE.
Nanoparticle silica insures a drill quality on par with FR4 materials.
EZIO-F is based on a very low (~10 wt%) berglass content. e
nature of the spread weave provides a uniform dielectric constant and
impedance as suggested by skew testing. EZIO-F was created for the
next generation of digital circuitry where digital transmission speeds
start at 25 gbps and reach 112 gbps. EZ-IO-F was also designed for
microwave applications operating at increasingly higher frequencies
where there is a need to combine both digital and microwave circuitry
onto one PWB. EZIO-F was developed to challenge the best FR4
materials at the fabricator level in the most dicult 30-40 layer digital
applications.
Skew testing suggests a maximum skew of 0.3 picoseconds/inch and
an average skew of <0.1 ps/inch with no artwork rotation. Artwork
rotation of 15° shows a maximum skew of ~0.05 ps/inch and an
average skew close to zero. Interestingly enough, skew is at over
frequency when tested from 1-20 GHz.
EZIO-F is manufactured on industry leading no prole copper.
e newer ULP copper outperforms rolled copper and is the new
benchmark for high performance laminates. Signicant reductions in
insertion loss can be achieved with ULP copper vs. HVLP or rolled
copper.
EZIO-F is best combined with Taconic’s FR28-0040-50S (DF = 0.0018
@ 10 GHz) non-reinforced prepreg to achieve a stripline channel
having ~5 wt% berglass. Taconic’s fastRise™ prepregs are the lowest
loss prepregs commercially available that can be laminated at FR4-like
420 °F lamination temperatures. e low insertion loss of EZIO-F/
fastRise™ is only rivaled by the fusion bonding of pure PTFE laminates,
an expensive process which causes excessive movement. fastRise™ is
typically used at 77 GHz and will compete favorably with any fusion
bonded laminate without the cost and challenges of fusion bonding.
EZIO-F can be obtained with the lowest prole resistor foils. e
nanoparticle’s design and lack of surface porosity enable the etching
of very ne lines (2-4 mil lines and spaces).
EZ-IO-F Spread Weave Next Generation Laminate