EZ-IO



is a thermally stable composite based on

nanotechnology and PTFE. e uniformity

granted by the nanotechnology enables consistent layer to layer

registration that is on par with the best FR4 materials. Although

EZ-IO has a very low level of berglass content (~5%), some

fabrication characteristics are similar to working with glass. Due

to the nanotechnology reinforcement, there is no more than 0.18%

dielectric constant variation PWB to PWB for a given channel. EZ-

IO was created for (1) the next generation of digital circuitry where

digital signal processing chips (SERDES) are at or beyond 25 gbps

and cannot tolerate unpredictable dielectric constant variation and

(2) microwave applications operating at increasingly higher speeds

where there is a need to merge both the digital and microwave

circuitry onto one PWB.

EZ-IO is best combined with Taconic’s FR-28-0040-50S (DF=0.0018

@ 10 GHz) non-reinforced prepreg to achieve a stripline channel

having 2-3 wt% berglass. Taconic’s fastRise™ prepregs are the lowest

loss prepregs commercially available that can be laminated at FR4-

like 420°F lamination temperatures. e combined low insertion

loss of EZ-IO/fastRise™ is only rivaled by the fusion bonding of

pure PTFE laminates, an expensive process which causes excessive

movement and puts stress on plated through holes. fastRise™ enables

the sequential lamination of EZ-IO at a low 420°F. Although the

insertion loss properties of EZ-IO rival that of pure PTFE bonding,

EZ-IO was developed to challenge the best FR4 materials at the

fabricator level in the most dicult 30-40 layer multilayer digital

applications.

ree of the largest fabricator costs are yield, material and

consumables (such as drill bits). Drill bit costs can exceed material

costs for complex PWBs. Drill time is another signicant cost

depending on fabricator capacity. EZ-IO was designed to have similar

hits/bit as typical FR4 materials and an acceptable drill fabrication

window much wider than traditional PTFE based composites. EZ-

IO can be bonded with the attest of available copper types, rolled

copper, HVLP or standard copper types.

An ISO 9001 Registered Company

www.taconic-add.com

Commercial and Government Entity (CAGE) Code: 1C6Q9

North & South America

Taconic - Headquarters

Petersburgh, NY 12138

Tel: 518-658-3202 / 1-800-833-1805

addinfo@4taconic.com

Europe/Middle East/Australia

Taconic International Ltd.

Republic of Ireland

Tel: +353-44-9395600

add@4taconic.com

Asia

Korea Taconic Company

Republic of Korea

Tel: +82-31-704-1858

sales@taconic.co.kr

China

Taconic Advanced Material (Suzhou) Co., Ltd.

Suzhou City, China

Tel: +86-512-6286-7170

tssales@taconic.co.kr

Benets & Applications:

• Nanotechnology based PTFE

laminate

• Drill quality of FR4 (1000+

hits/bit)

• Registration of FR4

• Extremely low berglass

content (~5%)

• 0.18% dielectric constant

variation within a lot

• Standard with at, HVLP or

rolled copper

• Temperature stable DK

• Capable of 40+ layer large

format PWBs

• CAF resistant

• Semiconductor testing at 25

gbps and higher

• Test and measurement

• Optical data transport and

backplane routers

• Hybrid FR4 PWBs combining

microwave and digital signals

• Space and defense

Mechanically drilled hole in EZIO (not yet plated). EZIO fabricates in some

aspects like glass

Mechanically drilled hole in EZ-IO

(not yet plated).

EZ-IO Next Generation PTFE Laminate