TSM-DS3
is a thermally stable, industry leading
low loss core (Df = 0.0011 at 10 GHz)
that can be manufactured with the predictability and consistency of
the best berglass reinforced epoxies. TSM-DS3 is a ceramic-lled
reinforced material with very low berglass content (~ 5%) that
rivals epoxies in fabricating large format complex multilayers.
TSM-DS3 was developed for high power applications (thermal
conductivity = 0.65 W/M*K) where it is necessary for the dielectric
material to conduct heat away from other heat sources in a PWB
design. TSM-DS3 was also developed to have very low coecients of
thermal expansion for demanding thermal cycling.
A TSM-DS3 core combined with fastRise™27 (Df = 0.0014 at 10
GHz) prepreg is an industry leading solution for the lowest possible
dielectric losses that can be attained at epoxy-like 420˚F fabrication
temperatures. e low insertion losses of TSM-DS3/fastRise™27 are
only rivaled by fusion bonding (the melting of pure Teon® laminates
from 550˚F to 650˚F). Fusion bonding is expensive, it causes
excessive material movement and it puts stress on plated through
holes. For complex multilayers, the price of poor yield drives up the
nal material cost. fastRise���27 enables the sequential lamination of
TSM-DS3 at a low 420˚F with consistency and predictability that
reduces cost.
For microwave applications, the low x, y and z CTE values assure that
critical spacings between traces in lters and couplers have very low
movement with temperature. TSM-DS3 can be used with very low
prole copper foils yielding a smooth copper edge between coupled
lines.
Registration over many layers is critical for yield and variations in
copper weight and copper etching across a panel can cause non-
linear movement. Non-linear movement over large panels leads to
a lack of registration of the drilled hole to the pad and possibly open
circuits.
TSM-DS3 is compatible with Ticer® and OhmegaPly®
resistive foils.
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
Benets & Applications:
• Industry best Df (Df = 0.0011
@10 GHz)
• High thermal conductivity
(0.65 W/M*K)
• Low (~5%) berglass content
• Dimensional stability rivals epoxy
• Enables large format high layer
count PWBs
• Builds complex PWBs in yield with
consistency and predictability
• Temperature stable Dk
+/- 0.25% (-30 to 120°C)
• Compatible with resistive foils
• Couplers
• Phased Array Antennas
• Radar Manifolds
• mmWave Antenna/Automotive
• Oil Drilling
• Semiconductor/ATE Testing
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
TSM-DS3 Dimensionally Stable Low Loss Laminate
Teflon® is a registered trademark of E.I. du Pont de Nemours and
Company
e TSM-DS3 dielectric constant shows a
+/- 0.2% deviation with temperature.
e dissipation factor varies from 0.0007 -
0.0011 over a typical application temperature
range.
Ring Resonator Properties vs. Frequency on
TSM-DS3-0100. (Test set up as shown on page 4).
Frequency (GHz)
Dk
Df (tan δ)
Insertion Loss (dB) - TSM-DS3
INSERTION LOSS - Loss Per Inch
Item 30 GHz 57 GHz 67 GHz
TSM-DS3 (Dk = 3.0)
Dielectric 5 mils
Trace Width = 12 mils
-1.038 dB -2.386 dB -2.861 dB
Synthetic Rubber Hydrocarbon
(Dk=3.38)
Dielectric 8 mils
Trace Width = 17 mils
-2.023 dB -3.553 dB -4.150 dB
Insertion loss comparison of TSM-DS3
vs. a synthetic rubber hydrocarbon
laminate.Test vehicle shown below using
Southwest Connectors.
TSM-DS3 Dimensionally Stable Low Loss Laminate