Benets & Applications:
• "Best in Class" loss tangent
• Exceptional thermal
management
• Dk stability across a broad
temperature range
• Enhanced antenna gains/
eciencies
• Excellent adhesion to Very
Low Prole copper
• Filters, couplers & power
ampliers
• Antennas
• Satellites
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
RF-35TC
oers a "best in class" low dissipation factor
with high thermal conductivity. is material
is best suited for high power applications where every 1/10
th
of a dB is
critical and the PWB substrate is expected to diffuse heat away from both
transmission lines and surface mount components such as transistors or
capacitors. RF-35TC is a PTFE based, ceramic filled fiberglass substrate.
It will not oxidize, yellow or show upward dri in dielectric constant and
dissipation factor like its synthetic rubber (hydrocarbon) competitors.
e low Z axis CTE and temperature stable Dk are critical for both narrow
band and broad band overlay couplers. e low X and Y CTE values
are crucial for maintaining critical distances between trace elements
in a printed lter. e extremely low Df of 0.0011 and high thermal
conductivity are particularly suited for power amplier applications. RF-
35TC bonds very well to low prole copper, further reducing insertion
loss.
Like most material properties, there are many techniques for measuring
thermal conductivity. ermal conductivity measured on an unclad
sample (no copper) oers the true thermal conductivity of the laminate.
Measurements on a copper clad laminate typically yield higher values as
the copper clad laminate oers the least thermal resistance at the interface
between the laminate and measuring equipment. When measured with
or without copper cladding, RF-35TC has a state-of-the-art thermal
conductivity. However, the low dissipation factor dierentiates RF-35TC
from the competition.
RF-35TC
Thermal image of 0603
capacitor at the center of a
microstrip (47pF/250V/C0G)
assembled on RF-35TC under
200 watts applied power.
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
RF-35TC Thermally Conductive Low Loss Laminate
RF-35TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modied) 3.50 3.50
T
c
K (-30 to 120 °C) IPC-650 2.5.5.5.1 (Modied) ppm 24 ppm 24
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modied) 0.0011 0.0011
Dielectric Breakdown IPC-650 2.5.6 (In-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149 (rough Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength (MD) ASTM D 790 / IPC-650 2.4.4 psi 12,900 N/mm
2
88.94
Flexural Strength (CD) ASTM D 790 / IPC-650 2.4.4 psi 11,700 N/mm
2
80.67
Tensile Strength (MD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 9,020 N/mm
2
62.19
Tensile Strength (CD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 7,740 N/mm
2
53.37
Elongation at Break (MD) ASTM D 3039 / IPC-TM-650 2.4.19 % 1.89 % 1.89
Elongation at Break (CD) ASTM D 3039 / IPC-TM-650 2.4.19 % 1.70 % 1.70
Young's Modulus (MD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 667,000 N/mm
2
4,599
Young's Modulus (CD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 637,000 N/mm
2
4,392
Poisson’s Ratio (MD) ASTM D 3039 / IPC-TM-650 2.4.19 0.18 0.18
Poisson’s Ratio (CD) ASTM D 3039 / IPC-TM-650 2.4.19 0.23 0.18
Compressive Modulus ASTM D 695 (23 °C) psi 560,000 N/mm
2
3,861
Flexural Modulus (MD) ASTM D 790 / IPC-650 2.4.4 psi 1.46 x10
6
N/mm
2
10,309
Flexural Modulus (CD) ASTM D 790 / IPC-650 2.4.4 psi 1.50 x 10
6
N/mm
2
10,076
Peel Strength (½ oz CVH) IPC-650 2.4.8 (ermal Stress) lbs./inch 7 N/mm 1.25
ermal Conductivity (Unclad, 125 °C) ASTM F433 (Guarded Heat Flow) W/(mK) 0.60 W/(mK) 0.60
ermal Conductivity (C1/C1, 125 °C) ASTM F433 (Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
ermal Conductivity (CH/CH, 125 °C) ASTM F433 (Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability (MD) IPC-650-2.4.39 Sec. 5.4 (Aer Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability (CD) IPC-650-2.4.39 Sec. 5.4 (Aer Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability (MD) IPC-650-2.4.39 Sec. 5.5 (ermal Stress) mils/in. -0.04 mm/M -0.04
Dimensional Stability (CD) IPC-650-2.4.39 Sec. 5.5 (ermal Stress) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1 (Aer elevated temp.) Mohms 8.33 x 10
7
Mohms 8.33 x 10
7
Surface Resistivity IPC-650 2.5.17.1 (Aer humidity) Mohms 6.42 x 10
7
Mohms 6.42 x 10
7
Volume Resistivity IPC-650 2.5.17.1 (Aer elevated temp.) Mohms/cm 5.19 x 10
8
Mohms/cm 5.19 x 10
8
Volume Resistivity IPC-650 2.5.17.1 (Aer humidity) Mohms/cm 2.91 x 10
8
Mohms/cm 2.91 x 10
8
CTE (X axis) (23 to 125 °C) IPC-650 2.4.41 / ASTM D 3386
ppm/°C
11
ppm/°C
11
CTE (Y axis) (23 to 125 °C) IPC-650 2.4.41 / ASTM D 3386
ppm/°C
13
ppm/°C
13
CTE (Z axis) (23 to 125 °C) IPC-650 2.4.41 / ASTM D 3386
ppm/°C
34
ppm/°C
34
Density ASTM D 792 g/cm
3
2.35 g/cm
3
2.35
Hardness ASTM D 2240 (Shore D)
79.1 79.1
Strain at Break (MD) ASTM D 790 / IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break (CD) ASTM D 790 / IPC-650 2.4.4 % 0.013 % 0.013
Specic Heat ASTM E 1269-05, E 967-08, E 968-02
j/(g °C)
0.940
j(g °C)
0.940
T
d
(2% Wt. Loss)
IPC-650 2.4.24.6/TGA °F 788 °C 420
T
d
(5% Wt. Loss)
IPC-650 2.4.24.6/TGA °F 817 °C 436
RF-35TC oers superior heat dissipation performance compared to competitive
materials through a combination of exceptional thermal conductivity and "best in class"
low dielectric loss.
RF-35TC
Thermal image of a microstrip
transmission line with 0805 capacitor at
center (47pF/250V/C0G) assembled on
RF-35TC under 200 watts applied power.
Maximum temperature as a function of
applied power for a microstrip and 0805
capacitor assembled on RF-35TC, RF-35 and
two competitive materials.
Maximum temperature as a function of
applied power for a microstrip and 0603
capacitor assembled on RF-35TC, RF-35 and two
competitive materials.
Maximum temperature as a function of
applied power for a microstrip transmission
line assembled on RF-35TC, RF-35 and two
competitive materials.
RF-35TC Thermally Conductive Low Loss Laminate