fastRise™
is designed to eliminate skew in
dierential transmission lines and
eliminate dielectric constant uctuations caused by berglass
in lter and coupler applications. is low temperature
thermosetting prepreg is based on ceramic, thermoset and
PTFE and is ideal for use with Taconic’s standard low loss
laminates like TSM-DS3 (Df=0.0011), TSM-DS3M (Df=
0.0011) and EZ-IO-F (Df=0.0014 to 0.0015).
For applications that require low loss at high frequencies,
fastRise™ prepreg oers design engineers the properties needed
for superior performance. e low 0.0017 Df at 40 GHz enables
the production of mmWave multilayer PWBs. In addition,
the low 420º F lamination temperature enables 5+ sequential
laminations to be performed at lower temperatures than those
normally used for FEP and PFA in military constructions.
Taconic currently has military applications involving four
sequential laminations of FR-27.
Due to the material’s low Dk, fastRise™ enables thickness
reduction of ATE Printed Circuit Boards. e availability of
many fastRise™ thicknesses allows exibility in high layer count
PWB design.
Taconic is a world leader in RF laminates and high speed
digital materials, oering a wide range of high frequency
laminates and prepregs. ese advanced materials are used
in the fabrication of antennas, multilayer RF and high speed
digital boards, interconnections and devices.
Benets & Applications:
• Enables 5+ sequential laminations
• Low Dk enables reduced thickness
of ATE boards
• Low temperature alternative
to thermoplastic lms in military
designs
• Multilayer prepreg for mmWave
applications
• Stable Dk over temperature
• Fiberglass free prepreg
• Laser ablatable
• Semiconductor Testing
• Military
• mmWave Antenna/Automotive
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
Cross section
illustrates the very low
berglass content of
FR-27 & multilayers.
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
fastRise
™
Multilayer Non-Reinforced Prepreg
ere are many fastRise™ part numbers due to the diverse number of tasks that a prepreg must fulll. For doing
sequential laminations where the intent is to ow and ll copper that has been plated up to 2-3 mils, high resin
content and high ow is required from the prepreg. For applications where you do not want the prepreg owing
into cavities, a low ow prepreg is desirable. Extremely high ow is needed for lling blind or buried vias or
milled out cavities. In some coupler designs, a very thin prepreg is desirable for maximum coupling between the
overlay couplers and sucient ow is only needed to bond artwork with 0.5 oz. copper. Low ow prepregs are
best for doing foil laminations. Flow and ll requirements don’t exist in a foil lamination so a low ow prepreg is
appropriate whereas a high ow prepreg might be more prone to cosmetic defects. Taconic has found that low ow
prepregs are most suitable for microvia formation following a foil lamination (the microvia cross sections below
are courtesy of Hughes Circuits). Taconic’s low ow prepregs have a much better lased hole quality than the high
ow prepregs.
In a high layer count PWB, oen there are many layers of overlapping edge coupled traces. High layer count PWBs
are susceptible to lamination voids due to areas of high and low pressure. For all of these reasons it is best to consult
the fastRise™ design guide or talk to a Taconic applications engineer to design with the most suitable prepreg.
Laser Ablation: Hughes Circuits - FR-28-0040-50
Foil Lamination Surface Smoothness
FR-27-0045-35
1
Some layers only
2
FR-27-0030-25, FR-27-0040-43F and FR-27-0045-35 can be used with 1 oz. copper on low layer count PWBs but should not be used where
many layers are bonded together in a single lamination due to the risk of low pressure areas during lamination.
3
Plated up subassemblies can vary in the ultimate copper thickness. A discussion with a Taconic Applications Engineer is advised.
4
Susceptible to common PTFE drilling defects
R = Recommended
Product
Stripline with 1
oz. Cu
High Layer
Count PWBs
Between Plated
Up Subassemblies
Fill Blind/
Buried Vias
Resin
Content
Microvia
Formation/Foil
Lamination
Drill Quality
FR-27-0030-25 See below
2
Yes
1
No No Low R Best
FR-27-0040-43F See below
2
Yes
1
See below
3
No Medium Best Best
FR-27-0045-35 See below
2
Yes
1
No No High R Best
FR-28-0040-50 (S) Ye s Ye s See below
3
No High R Best
FR-27-0050-40 (S) Ye s Ye s See below
3
No High R Best
Standard fastRise™ Part Numbers
Product
Stripline with
1 oz. Cu
High Layer
Count PWBs
Between Plated
Up Subassemblies
Fill Blind/
Buried Vias
Resin
Content
Microvia
Formation/Foil
Lamination
Drill Quality
FR-25-0021-45 (F) No No
1
No No Low No Susceptible
4
FR-26-0025-60 Ye s Yes
1
See below
3
No High No Susceptible
4
FR-27-0035-66 Ye s Yes
1
Ye s Ye s High No Susceptible
4
FR-27-0042-75 Ye s Yes
1
Ye s Ye s Highest No Susceptible
4
Specialty fastRise™ Part Numbers
fastRise
™
Multilayer Non-Reinforced Prepreg