Technical data sheet
curamik® CERAMIC SUBSTRATES
Al
2
O
3
W/mK @ °C
HPS
W/mK @ °C
Si
3
N
4
W/mK @ °C
AlN
W/mK @ °C
Al
2
O
3
Alumina curamik® Power
HPS*
Alumina (% ZrO
doped) curamik® Power Plus
Si
3
N
4
Silicon Nitride curamik® Performance
AlN
Aluminum Nitride curamik® Thermal
Thermal conductivity
Available materials
copper thicknesses mm
0.127 0.2 0.25 0.3 0.4 0.5
ceramic thicknesses mm
0.25 HPS HPS HPS
0.32
AI
AI
HPS
AI
HPS
AI
HPS HPS HPS
0.38
AI
AI
AI
AI
0.5
AI
AI
AI
AI
AI
0.63
AI
AIN
AI
AIN
AI
AIN
AI
AIN
1.00
AI
AIN
AI
AIN
AI
AIN
AI
AIN
ceramic thicknesses mm
copper thicknesses mm
0.3 0.5 0.8
0.25 Si
N
Si
N
Si
N
0.32 Si
N
Si
N
Si
N
Available thickness combinations DBC
Available thickness combinations AMB
* The HPS products are subject to patent restrictions in some countries.
Note other copper thicknesses on request.
curamik® CERAMIC SUBSTRATES Technical data sheet
Total dimensions
master card
mm x . mm ± .%
Max. useable area mm x mm ± .%
Copper peeling strength ≥ . N/mm @ mm/min for DBC with
. mm Cu-thickness
≥ . N/mm @ mm/min for AMB with
. mm Cu-thickness
Platings Electroless Ni: m – m (% ± % P) all-over
Electroless Ag : . m – . m all-over
Electroless Au Class A: . . µm all-over on Ni
Electroless Au Class B: . . µm all-over on Ni
Roughness* R
a
≤ m; R
z
≤ m; R
max
= m
General dimensions
Surface options
Typ. width of / spacing between conductors
Al
2
O
3
. ppm/K @ °C - °C
HPS . ppm/K @ °C - °C
Si
3
N
4
. ppm/K @ °C - °C
AlN . ppm/K @ °C - °C
Coefficient of linear thermal expansion (CTE)
with copper plating 5% to 60% higher (dependent on copper thickness)
* Lower roughness on request
Rogers Corporation
www.rogerscorp.com/pes
www.curamik.com
The information contained in this document is intended to assist you in designing with Rogers’ Power Electronics Solutions Materials. It is not intended to and
does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown in this
document will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers curamik products for each application. The Rogers
logo, the curamik logo and curamik are trademarks of Rogers Corporation or one of its subsidiaries.
© Rogers Corporation. All rights reserved. Publication # . Version . en.
Cu-thickness width DBC width AMB
. mm typ. . mm n/a
. mm typ. . mm n/a
. mm typ. . mm n/a
. mm typ. . mm typ. . mm
. mm typ. . mm n/a
. mm typ. . mm typ. . mm
. mm n/a n/a
. mm n/a typ. . mm
d = Cu-thickness
W = Width
W
Copper
Ceramic
Pitch
d