fastRise™ EZ pure Resin
Benets & Applications:
• FR4 lamination temperatures
• Low DK enables reduced PWB
thickness for the same impedance
• ermosetting prepreg will not
reow
• Fiberglass-free prepreg
• Compatible with conventional
lamination processes
• Can be combined with any core
material
• Laser Ablatable
• High Speed Flex Cables
• Thin Multilayers
• ATE testing
• mmWave Antenna/Automotive
• Bonding of Subassemblies
North & South America
Taconic - Headquarters
Petersburgh, NY 12138
Tel: 518-658-3202 / 1-800-833-1805
addinfo@4taconic.com
Europe/Middle East/Australia
Taconic International Ltd.
Republic of Ireland
Tel: +353-44-9395600
add@4taconic.com
Asia
Korea Taconic Company
Republic of Korea
Tel: +82-31-704-1858
sales@taconic.co.kr
China
Taconic Advanced Material (Suzhou) Co., Ltd.
Suzhou City, China
Tel: +86-512-6286-7170
tssales@taconic.co.kr
An ISO 9001 Registered Company
www.taconic-add.com
Commercial and Government Entity (CAGE) Code: 1C6Q9
fastRise™EZpure
is a low temperature
curing adhesive for
exible and rigid PWBs. EZpure is a non-reinforced adhesive containing
only a low loss thermosetting resin and ceramic additives. EZpure has
been optimized to adhere to dicult-to-bond-to substrates like PTFE,
polyimide (DuPont™ Pyralux® AP/TK exible circuit materials) and LCP.
e primary drawback of polyimides, LCPs and PTFE is the high
temperatures normally associated with multilayer fabrication. EZpure
can be laminated at 200°C, thus preventing any unwanted dimensional
movement of the copper clad laminate core. Because EZpure has no
reinforcement and uses only submicron or micron sized additives , it
should be laminated at low pressure (~ 100 psi) because there is nothing
restraining high ow.
In testing EZpure bondply with LCP cores, PWBs have passed 260°C
and 300°C solder reow without defects. FR-EZpure has exhibited 5-7
lbs. of adhesion to LCP cores and that adhesion is stable aer 260°C and
300°C thermal cycling.
EZpure’s low loss enables the design of exible high speed cables and
rigid RF/digital multilayers without the uncertainties and costs associated
with the high temperature lamination of PTFE or LCP materials. EZpure
can be used to replace cable harnesses with denser ex circuits. e
lack of a reinforcement makes EZpure a great candidate for laser vias.
e low moisture absorption of 0.3% is very attractive vs. conventional
polyimides.
EZpure can be sequentially laminated and has better bonding capabilities
with copper than other RF prepregs. e low DK of EZpure is advantageous
in ex applications to reduce thickness while maintaining the same
impedance. e low modulus of EZ pure allows for more ductility in
a thicker multilayer. e low dissipation values of EZpure is an option
for any multilayer stackup where pure packages of other materials have
fabrication challenges.
All reported values are typical and should not be used for specication purposes. In all instances, the user shall determine suitability in any given application.
fastRise™EZpure Typical Values
Property Test Method Unit EZpure
ickness mil 1.5, 2.0, 3.0
Dk @ 10 GHz IPC-650 2.5.5.5.1 2.8
Df @ 10 GHz IPC-650 2.5.5.5.1 0.0032
T
c
K IPC-650 2.5.5.5.1 ppm/ºC -19.4
Dielectric Breakdown ASTM D 149-09A kV 25.1
Dielectric Strength ASTM D 149-09A V/mil 900
Moisture Absorption IPC-650 2.6.2.1 % 0.31
Moisture/Insulation Resistance IPC-650-2.6.3.2 Mohms 275,000
Flexural Strength (x, y) ASTM D 790 psi 3,000
Flexural Modulus (x, y) ASTM D 790 psi 77,000
Tensile Strength IPC-650 2.4.19 psi 800
Elongation at break IPC-650 2.4.19 % 19.5
Young’s Modulus IPC-650 2.4.19 kpsi 118
Peel Strength IPC-650 2.4.9E lbs/in 3.0
Peel Strength (aer solder oat) IPC-650 2.4.9E lbs/in 3.0
Peel Strength (aer thermocycling) IPC-650 2.4.9E lbs/in 3.0
ermal Conductivity ASTM F 433/ASTM 1530-06 W/M*K 0.33
Dimensional Stability (MD) IPC-650 2.2.4 (TS) mils/in. -9.8
Dimensional Stability (CD) IPC-650 2.2.4 (TS) mils/in. -10.3
T
g
ºC 168
Surface Resistivity IPC-650-2.5.17E Mohms/cm 3.75 x 10
6
Volume Resistivity IPC-650-2.5.17E Mohms/cm 2.24 x 10
8
Chemical Resistance IPC-650-2.3.2G % 90
CTE (X, Y, Z) (35 to 200 ºC) IPC-650 2.4.41 ppm/ºC 44
Density ASTM D 792 g/cm
3
1.43
T
d
(2% Wt. Loss) IPC-650 2.4.24.6 (TGA) ºC 375
T
d
(5% Wt. Loss) IPC-650 2.4.24.6 (TGA) ºC 386
Fungus Growth IPC-650-2.6.1 0 (no growth)
12/17
EZpure
Pyralux® AP
EZpure
EZpure
Pyralux® AP
Pyralux® AP
0
10
20
30
40
50
60
70
0 50 100 150 200 250
Flow (%)
Pressure (PSI)
fastRise™ EZpure Flow Dependence on Pressure