Revision: December, 2012 www.wontop.com
Material Composition Declaration
Package Information
Package Package Weight (mg) Terminal Finish MSL Rating
WOB 1100 Matte Tin (Sn) N/A
Product Group
Type No. Description
RB150 – RB1510 Bridge Rectifier 1.5A 50V – 1000V
W005G – W10G Bridge Rectifier 1.5A 50V – 1000V
W005M – W10M Bridge Rectifier 1.5A 50V – 1000V
Component Material Substance CAS No.
Material
Mass
(%)
Material
Mass
(mg)
Component
Mass
(%)
Component
Mass
(mg)
PPM
Die Doped Silicon* Si 7440-21-3 100.00 23.32 2.12 23.32 21200
Pb 7439-92-1 92.50 15.97 14523
Sn 7440-31-5 5.00 0.86 785
Die Attach Solder Alloy
Ag 7440-22-4 2.50 0.43
1.57 17.27
393
Cu 7440-50-8 97.78 404.96 368142
Fe 7439-89-6 2.15 8.90 8095
Leadframe Copper Alloy
Zn 7440-66-6 0.07 0.29
37.65 414.15
264
Plating Matte Tin Sn 7440-31-5 100.00 23.54 2.14 23.54 21400
SiO
2
14808-60-7 64.66 278.81 253467
Epoxy Resin 29690-82-2 29.40 126.77 115248
Brominated
Epoxy Resin
6386-73-8 2.97 12.81 11642
Encapsulation
EMC
Sb
2
O
3
1309-64-4 2.97 12.81
39.20 431.20
11642
Case Plastic Case Phenol Resin 9003-35-4 100.00 190.52 17.32 190.52 173200
Tolerance ±10%
*Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable
level per EIA JIG-101.
Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering
calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate.
However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without
further notice.
RoHS Declaration
The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics
Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), P olybrominated Biphenyls
(PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in
homogeneous materials of electronics products.
The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing,
components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these
hazardous substances in quantity levels higher than or equal to the thresholds to this directive.
Exemptions as declared for the directive are:
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
7(c)-I Lead in glass (applicable for glass passivatied silicon die).
WON-TOP ELECTRONICS
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