DIAMOND SYSTEMS CORPORATION
DIAMOND SYSTEMS CORPORATION Tel (650) 810-2500
1255 Terra Bella Ave. Fax (650) 810-2525
Mountain View, California 94043 USA www.diamondsystems.com
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For Immediate Release
Contact: David Fastenau (650) 810-2514
Email: dfastenau@diamondsystems.com
Diamond Systems Joins Qseven Consortium
Leading embedded solution provider to team up Qseven computer-on-modules with
FeaturePak™ I/O modules for rapid development of application-oriented OEM baseboards
Mar. 2, 2010;Nuremberg, GERMANY -- Diamond Systems Corp., a leading supplier of ruggedized single-
board computers (SBCs) and I/O expansion modules targeting real-world applications, today announced
that it has become a Participating Member of the Qseven Consortium, a multi-vendor standards body
dedicated to advancing the Qseven computer-on-module (COM) standard.
Through its participation in the Qseven Consortium,
Diamond will develop and deliver off-the-shelf and
customized board-level subsystems that integrate
Qseven embedded computing cores, Diamond’s
industry-leading analog, digital, serial, wireless, and
other I/O technologies, and flexible expansion via
industry-standard FeaturePak modules. These
modular application-ready subsystems will assist
OEMs in precisely meeting the budget, energy
consumption, and performance requirements of
their applications, while shortening time-to-revenue
and reducing development costs and risks.
“The Qseven COM (computer-on-module) standard
packs the latest low-power, embedded processors,
chipsets, and standard system interfaces into a
highly compact package while eliminating the need
for expensive connectors that unnecessarily burden
system costs,�� noted Diamond Systems Founder and President Jonathan Miller. “Additionally, Qseven
COMs and FeaturePak I/O modules are extremely well suited for deployment together on standard and
customized application baseboards.”
“We’re excited to welcome Diamond Systems as the newest Participating Member of the Qseven
Consortium,” said Martin Danzer of Qseven Consortium Founding Member company congatec AG. As the
originator of the newly introduced FeaturePak I/O module standard, Diamond has added a significant new
companion technology for adding off-the-shelf I/O modules to embedded designs based on Qseven
embedded computing cores.
About the Qseven Consortium
The Qseven Consortium, founded in 2007 by congatec AG, Seco s.r.l. and MSC Vertriebs GmbH, is a multi-
vendor organization dedicated to advancing use of the Qseven computer-on-module (COM) standard
throughout the global embedded computing industry. Qseven COMs adhere to a standardized form-factor
of 70mm x 70mm and plug into application baseboards via a single, high-speed, 230-pin MXM connector.
Qseven modules integrate all core functions of an embedded computer, including CPU, memory, and
interfaces for graphics, audio, mass storage, network, USB and other I/O expansion. The MXM baseboard
interface connector carries all signals to and from the Qseven module, including system buses such as PCI
Express and LPC, and I/O interface signals for functions such as USB, SATA, gigabit Ethernet, graphics,
and audio. The Qseven Consortium currently has 21 Participating Members.
For more information, visit www.qseven-standard.org.
DIAMOND SYSTEMS CORPORATION
DIAMOND SYSTEMS CORPORATION Tel (650) 810-2500
1255 Terra Bella Ave. Fax (650) 810-2525
Mountain View, California 94043 USA www.diamondsystems.com
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About Diamond
Founded in 1989, Diamond Systems Corporation is a leading supplier of compact, rugged, wide-
temperature embedded computing solutions for a wide range of applications in fixed and mobile
environments. The company was an early adopter of PC/104 technology and today is one of the leading
worldwide suppliers of PC/104 I/O modules and highly integrated single board computers combining CPU
and data acquisition on a single board. Diamond’s extensive product line includes A/D, D/A, digital I/O,
serial communications, wired and wireless networking, and power supply modules as well as single-board
computers and enclosures. Diamond also offers a full range of system solutions, including the capability to
customize boards or systems to meet the needs of a particular application. The privately held company is
based in Mountain View, California, in the heart of Silicon Valley.
For more information, visit www.diamondsystems.com or call 1-800-36-PC104.
Related Story
In related news, Diamond Systems today participated in the launch
of the FeaturePak Initiative. The FeaturePak specification,
originated by Diamond, defines tiny, application-oriented
personality modules three-fifths the size of a credit card (depicted
at right) that snap into low-cost, low-profile sockets on single
board computers (SBCs), computer-on-module (COM)
baseboards, and full-custom electronic circuit boards.
For more information, visit www.featurepak.org.