Suitable for harsh environmental conditions from -55 °C up to +150 ºC

Effective protection against solder cracks, flex cracks, and damage from

vibrations and shocks

Broadest lineup of crack-resistant MLCCs for automotive applications

Qualified to AEC-Q200

TDK Corporation announces the introduction of high temperature resistant MLCCs with soft terminations, expanding

the CGA series of MLCCs for automotive applications. These components employ electrodes made of conductive

resins that provide effective protection against solder cracks caused by thermal cycling, flex cracks caused by stress to

the PCB, and damage due to vibrations and shocks. In addition, the new CGA series of MLCCs employ an X8R

dielectric material and are thus able offer stable capacitance values (±15 percent) at temperatures from -55 °C to

+150 °C.

The new components are available in package sizes of IEC 1005 (EIA 0402) to IEC 3225 (EIA 1210) and offer rated

capacitances ranging from 150 pF to 10 µF and rated voltages from 16 V to 100 V. The new series include the world’s

only X8R soft-termination MLCC in an IEC 1005 package*. Thus, TDK offers the broadest lineup of crack-resistant

MLCCs designed for demanding automotive applications. These components are especially suitable for ECUs used in

high temperature environments such as engine compartments and where space is at a premium as well as for use in

smoothing and decoupling circuits. Mass production of the new MLCCs, which are qualified to AEC-Q200, will start in

June 2015.

Modern cars increasingly rely on electronic systems and implement electric operation, which has led to a drastic

increase in the number of electronic components found in such vehicles. At the same time, there is a strong trend

towards locating electronic control units in the engine compartment or near other structural parts in order to gain more

space for passengers. Electronic components used for such applications must be able to withstand high temperatures

and severe vibrations. The new MLCCs retain all the advantages of existing soft-termination products and are fully

compliant with the industry's most stringent X8R specifications.

* As of April 2015, according to TDK investigations

Glossary

X8R temperature characteristics: Dielectric material with ±15 percent change in capacitance in the temperature

range from -55°C to +150°C

Flex cracks: After MLCCs have been soldered to a PCB, handling processes such as board splitting, insertion of

sockets and leaded components, and screw-down can cause the PCB to bend, and the accompanying tensile

stresses can lead to cracks in the MLCC itself.

Solder cracks: In an environment subject to repeated and drastic changes between high and low temperatures,

thermal stress occurs in the solder section of components due to the different thermal expansion coefficients of the

component and the PCB, leading to solder cracks.

Main applications

Automotive ECUs in high temperature environments such as engine compartments

Smoothing circuits and decoupling circuits

Main features and benefits

Suitable for harsh environmental conditions from -55 °C up to +150 ºC

High resistance against solder cracks caused by thermal cycling, flex cracks caused by stress to the PCB, and

damage due to vibrations and shocks

Wide capacitance range from 150 pF to 10 μF

Qualified to AEC-Q200

Multilayer ceramic chip capacitors May 2015

Soft-termination MLCCs with X8R

thermal characteristics for

automotive applications

Products & Technologies