Page 1
Formosa MS
FFM101-MH1 THRU FFM107-MH1
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121211 2014/01/20
-
A 7
Chip Fast Recovery Rectifiers
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7
List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings and .................................
Electrical characteristics
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
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Formosa MS
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
Batch process design, excellent power dissipation offers•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
•
optimize board space.
iny plastic SMD package.
• T
High current capability.
•
•
Fast switching for high efficiency.
High surge current capability.
•
Glass passivated chip junction.•
Lead-free parts meet RoHS requirments.•
•
Suffix "-H" indicates Halogen-free parts, ex. FFM101-MH1-H.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
Maximum ratings and Electrical characteristics (AT T =25 C unless otherwise noted)
A
o
Chip Fast Recovery Rectifiers
Note 1. Reverse recovery time test condition, I =0.5A, I =1.0A, I =0.25A
FRRR
2.
Measured at 1 MHz and applied reverse voltage of 4.0 VDC
FFM101-MH1 THRU FFM107-MH1
SYMBOLS
PARAMETER
FFM101-MH1
FFM102-MH1
FFM103-MH1
UNIT
FFM104-MH1 FFM105-MH1 FFM106-MH1 FFM107-MH1
Maximum repetitive peak reverse voltage
V
RRM
50
100
200 400
600 800
1000
V
V
Maximum RMS voltage
V
RMS
35
70
140 280
420 560
700
Maximum DC blocking voltage
V
DC
50
100
200 400
600 800
1000
V
Maximum average forward rectified current
I
O
1.0
A
Peak forward surge current 8.3ms
single half sine-wave(JEDEC method)
I
FSM
25
A
Maximum forward voltage at I =1.0A
F
V
F
1.30
V
I
R
Maximum DC reverse current T =25 C
J
°
at rated DC blocking voltage T =125 C
J
°
5.0
100
uA
uA
C
J
Typical junction capacitance (Note 2)
15
pF
Maximum reverse recovery time (Note 1)
t
rr
150
ns
250 500
T
J
Operating junction temperature range
-55 to +150
°C
T
STG
Storage temperature range
-65 to +175
°C
DS-121211 2014/01/20 - A 7
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H1
Terminals :Plated terminals, solderable per MIL-STD-750,
•
Method 2026
Polarity : Indicated by cathode band
•
Mounting Position : Any•
Weight : Approximated 0.0103 gram•
Package outline
Dimensions in inches and (millimeters)
SOD-123H1
0.031(0.8) Typ.
0.146(3.7)
0.130(3.3)
0.004(0.1) Typ.
0.031(0.8) Typ.
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
0.040(1.0)
0.024(0.6)
R
θJA
Typical thermal resistance junction to ambient
Typical thermal resistance junction to case
73
53
°C/W
R
θJC
°C/W