Altera FabMatch
®
Datapack
1
© 2011 Altera Corporation Altera Confidential
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Altera FabMatch
®
Datapack
2
© 2011 Altera Corporation Altera Confidential
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EXECUTIVE SUMMARY……………………………………………………………………………………………………………...4
FABMATCH
®
PROCESS ........................................................................................................................................................................ 5
CERTIFICATION .................................................................................................................................................................................... 6
TSMC FACILITIES ................................................................................................................................................................................. 7
FAB 8 – HSINCHU, TAIWAN ........................................................................................................................................................................................ 7
FAB 11 – CAMAS, WASHINGTON ............................................................................................................................................................................... 8
PROCESS TECHNOLOGY DATA........................................................................................................................................................ 9
PROCESS TECHNOLOGY DATA SUMMARY……………………………………………………………………………………10
CHIP STRUCTURE CROSS SECTION…….……………………………………………………………………………………………………11
TRANSISTOR CROSS SECTION …………………………………………………………………………………………………………….... 12
FLASH CELL CROSS SECTION……………………………………………………………………………………………………………….. 13
PROCESS CD IN-LINE MEASUREMENTS…………………………………………………………………………………………………… 14
TRANSISTOR SPECIFICATIONS……………………………………………………………………………………………………….………15
1.8V Core/uLL & 3.3V I/O Transistor Specifications……………………………………………………………………………………………………. .15
5.0V High-Voltage (HV) Transistor Specifications……………………………………………………………………………………………………… ..16
1.8V NMOS………….…..…………………………���………………………………………………………………………………………………...... ..17
1.8V PMOS…………..……………………………………………………………………………………………………………………………….…….18
1.8V uLL NMOS………….…. ………………………………………………………………………………………………………………………...... ..19
1.8V uLL PMOS……..……………………………………………………………………………………………………………………………….…….20
3.3V NMOS………���.……………………………………………………………………………………………………………………………………. 21
3.3V PMOS………….. …………………………………………………………………………………………………………………………………… 22
5.0V NMOS………….……………………………………………………………………………………………………………………………..……... .23
5.0V PMOS…………..………………………………………………………………………………………………………………………………........ .24
5.0V ZMOS………….………………………………………………………………………………………………………………………………….…. 25
RESISTANCE SPECIFICATIONS……………………………………………………………………………………………………………….26
Metal and Poly Resistance Specifications………..……………………………………………………………………………………………………….. .26
Contact and Via Resistance Specifications………………………………………………………………………………………………………………… 27
Diffusion and Poly Sheet Resistance Specifications ……………………………………………………………………………………………………… 28