Capacitance drift of only 0.3 percent over a temperature range from

-55 ºC to +125 ºC

High capacitance stability at a high DC bias

Qualified to AEC-Q200

TDK Corporation has expanded its lineup of automotive-grade soft-termination and MEGACAP Type MLCCs with new

C0G types. Until now, these robust MLCC designs, which offer effective protection against board flexure and solder

cracks, have been available with X5R, X7R and X8R dielectric materials. The new types combine the low relative

permittivity of the C0G dielectric with rated capacitance values up to 300 nF and enable MLCCs to be used in an even

greater range of applications where reliability is required. Their rated voltages range from 50 V to 3000 V.

The new MLCCs feature high capacitance stability at a high DC bias. Moreover, the capacitance drift is only

0.3 percent over a broad temperature range from -55 ºC to +125 ºC, making the new Class 1 MLCCs especially well-

suited for the high-precision resonant circuits for fast and efficient automotive wireless charging and in LLC resonant

circuits of onboard chargers for plug-in hybrid and electric vehicles. The new types are qualified to AEC-Q200. In

addition to the expanded range of automotive applications, the new C0G MLCCs are also suitable for use in circuits

requiring high reliability or as replacements for other types of capacitors. Mass production and sales of the new

components will begin in December 2016.

Glossary

C0G: A dielectric material with a temperature characteristic in which capacitance changes within only 0.3% over a

temperatures range from -55 ºC to 125 ºC.

Class 1 ceramic capacitors: Offer high stability and low losses for resonant circuit applications.

Soft termination: The terminal electrode of standard products consists of three layers: copper (Cu), nickel (Ni), and

tin (Sn). The terminal electrode of soft-termination products consists of four layers, with a resin layer inserted

between the copper and the nickel to protect against board flexure cracks, solder cracks from thermal shocks.

MEGACAP Type: An MLCC design with metal lead frames attached to both ends of an MLCC to protect against

board flexure cracks, solder cracks from thermal shocks. MEGACAP Type MLCCs are available in two basic

designs: the single type and the stacked type.

Main applications

Wireless chargers for electric vehicles

LLC resonant circuits of onboard chargers for plug-in hybrid and electric vehicles

Circuits that require high reliability (time constant circuits, filter circuits, resonant circuits, oscillation circuits, snubber

circuits, etc.)

Main features and benefits

Capacitance drift of only 0.3 percent over a temperature range from -55 ºC to +125 ºC

High capacitance stability at a high DC bias

Effective protection against board flexure and solder cracks

Qualified to AEC-Q200.

Multilayer ceramic chip capacitors November 2016

Automotive-grade soft-

termination and MEGACAP Type

MLCCs with C0G characteristics

Products & Technologies

1 /© EPCOS AG · A TDK Group Company · Edition 2018 · www.epcos.com

Key data

Soft-termination MLCCs with resin terminal electrode layer

MEGACAP Type MLCCs with metal lead frames

Series Case size [IEC] Rated voltage[V] Max. capacitance[nF]

CGA2 1005 (EIA 0402) 50, 100 1

CGA3 1608 (EIA0603) 50 to 250 10

CGA4 2012 (EIA 0805) 50 to 450 33

CGA5 3216 (EIA 1206) 50 to 630 100

CGA6 3225 (EIA 1210) 100 to 1000 68

CGA8 4532 (EIA 1812) 630, 3000 33

CGA9 5750 (EIA 2220) 100 to 630 150

Series Case size [IEC] Rated voltage [V] Max. capacitance [nF]

CKG32K 3225 (EIA 1210), single type 100 to 1000 68

CKG45K 4532 (EIA 1812), single type 250 to 630 68

CKG45N 4532 (EIA 1812), stacked type 250 to 630 140

CKG57K 5750 (EIA 2220), single type 250 to 630 150

CKG57N 5750 (EIA 2020), stacked type 250 to 630 300

Products & Technologies